IP Library › Granted Patent US 6,538,211
Granted Patent Utility
US 6,538,211 · Confirmation No. 5718

MULTI-LAYER CIRCUITS AND METHODS OF MANUFACTURE THEREOF

Patented Case View Patent ↗ View Publication ↗
⬇ PDF
 Code Description Pages PDF
2001-12-13 TRNA Transmittal of New Application 5 View
2001-12-13 SPEC Specification 14 View
2001-12-13 CLM Claims 5 View
2001-12-13 ABST Abstract 1 View
2001-12-13 DRW Drawings-only black and white line drawings 3 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,538,211
App. No.
10/020,590
Filed
2001-12-13
Granted
2003-03-25
Pub. No.
US20020074158A1
Art Unit
2827
PTA
-6 days