Substrate with raised surface portion

1. An apparatus comprising:

(a) a substrate including a deposition region and an optional uncoated region, wherein the deposition region includes a level intermediate region disposed between a first end region and a second end region,

wherein the first end region includes a first raised surface portion extending above the level intermediate region and extending circumferentially around the first end region in a continuous manner wherein the first raised surface portion extends above the level intermediate region by a value ranging from about 0.5 to about 1,000 micrometers; and

(b) a dip coated layer over the entire deposition region including over the first raised surface portion.

2. The apparatus of claim 1 , wherein the substrate is a cylinder.

3. The apparatus of claim 1 , wherein the uncoated region is present.

4. The apparatus of claim 1 , wherein the first raised surface portion has a triangular shape when viewed in cross section.

5. The apparatus of claim 1 , wherein the first raised surface portion has a level top surface.

6. The apparatus of claim 1 , where in the first raised surface portion extends into the uncoated region.

7. The apparatus of claim 1 , wherein the clip coated layer comprises a charge transport material.

8. The apparatus of claim 1 , wherein the portion of the dip coated layer over the intermediate region has a substantially uniform thickness.

9. The apparatus of claim 1 , wherein the second end region includes a second raised surface portion extending above the level intermediate region and extending circumferentially around the second end region in a Continuous manner.

10. An apparatus comprising:

(a) a substrate defining a longitudinal axis and including a deposition region and an optional uncoated region, wherein the deposition region includes a level intermediate region disposed between a first end region and a second end region,

wherein the first end region includes a plurality of raised surface portions, each of the raised surface portions extending above the level Intermediate region and extending only partially around the first cad region, wherein the plurality of the raised surface portions, when viewed at a substrate end view, collectively extend circumferentially around the first end region in a continuous manner; and

(b) a dip coated layer over the entire deposition region including over the plurality of the raised surface portions.

11. The apparatus of claim 10 , wherein the plurality of the raised surface portions ranges in number from 2 to 5.

12. A coating method comprising:

(a) providing a substrate including a deposition region and an optional uncoated region, wherein the deposition region includes a level intermediate region disposed between a first end region and a second end region,

wherein the first end Legion includes a first raised surface portion extending above the level intermediate region and extending circumferentially around die first end region in a continuous manner; and

(b) dip coating a layer of a coating solution over the entire deposition region including over the first raised surface portion.

13. The coating method of claim 12 , wherein the substrate is a cylinder.

14. The coating method of claim 12 , wherein the first raised surface portion extends above the level intermediate region by a value ranging from about 0.5 to about 1,000 micrometers.

15. The coating method of claim 12 , wherein the first raised surface portion has a triangular shape when viewed in cross section.

16. The coating method of claim 12 , wherein the tint raised surface portion has a level top surface.

17. The coating method of claim 12 , wherein the rust raised surface portion extends into the uncoated region.

18. The coating method of claim 12 , wherein the dip coated layer comprises a charge transport material.

19. The coating method of claim 12 , wherein the portion of the dip coated layer over the intermediate region has a substantially uniform thickness.