IP Library › Granted Patent US 6,638,146
Granted Patent Utility
US 6,638,146 · Confirmation No. 3974

RETENTION PLATE FOR POLISHING SEMICONDUCTOR SUBSTRATE

Inventor: Naoya Naruo
Patented Case View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2003-08-08 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-12-20 TRNA Transmittal of New Application 1 View
2001-12-20 ADS Application Data Sheet 1 View
2001-12-20 SPEC Specification 10 View
2001-12-20 CLM Claims 1 View
2001-12-20 ABST Abstract 1 View
2001-12-20 DRW Drawings-only black and white line drawings 3 View
2001-12-20 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,638,146
App. No.
10/022,415
Filed
2001-12-20
Granted
2003-10-28
Pub. No.
US20020098786A1
Art Unit
3723
PTA
-86 days