IP Library Granted Patent US 6,853,663
Granted Patent B2
US 6,853,663 · App. 10/026,232 · Granted Feb 8, 2005

Efficiency GaN-based light emitting devices

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,853,663
App. No.
10/026,232
Granted
Feb 8, 2005
Kind
B2
Abstract

An optical semiconductor device having an active layer for generating light via the recombination of holes and electrons therein. The active layer is part of a plurality of semiconductor layers including an n-p junction between an n-type layer and a p-type layer. The active layer has a polarization field therein having a field direction that depends on the orientation of the active layer when the active layer is grown. In the present invention, the polarization field in the active layer has an orientation such that the polarization field is directed from the n-layer to the p-layer.

Claims (12)

1. An optical semiconductor device comprising an edge-emitting laser having an active layer comprising, an n-p junction between an n-type layer and a p-type layer, said active layer emitting light when holes and electrons recombine therein, said active layer having a polarization field therein having a field direction that depends on the orientation of said active layer when said active layer is grown, wherein said active layer has an orientation such that said polarization field is directed from said n-layer to said p-layer, said semiconductor device further comprising a substrate, an n-type base layer on said substrate, and a reverse biased tunnel diode between said active layer and said n-type base layer.

2. The optical semiconductor device of claim 1 wherein one of said layers comprises GaN.

3. An optical semiconductor device having an active layer comprising an n-p junction between an n-type layer and a p-type layer, said active layer emitting light when holes and electrons recombine therein, said active layer having a polarization field therein having a field direction that depends on the orientation of said active layer when said active layer is grown, wherein said active layer has an orientation such that said polarization field is directed from said n-layer to said p-layer, wherein said semiconductor layers are grown on an n-type GaN base layer having a reversed c-axis.

4. The optical semiconductor device of claim 3 wherein said base layer comprises a GaN layer grown by molecular beam epitaxial deposition.

5. An optical semiconductor device having an active layer comprising, an n-p junction between an n-type layer and a p-type layer, said active layer emitting light when holes and electrons recombine therein, said active layer having a polarization field therein having a field direction that depends on the orientation of said active layer when said active layer is grown, wherein said active layer has an orientation such that said polarization field is directed from said n-layer to said p-layer, wherein said semiconductor device is grown on a substrate having a planar surface and wherein said n-p junction is titled at an angle with respect to said substrate.

6. In a method for fabricating a semiconductor light emitting device comprising a plurality of semiconductor layers including an active layer between an n-type layer and a p-type layer, said active layer generating light by the recombination of holes and electrons, said active layer having a polarization field therein with a field direction that depends on the orientation of said active layer when said active layer is grown, the improvement comprising growing one of said plurality of semiconductor layers on a base layer such that said polarization field is directed from said n-layer to said p-layer,

wherein said base layer is generated by growing a GaN seed layer having a top and bottom surface, said bottom surface being in contact with a substrate that causes said GaN layer to have a crystal orientation in the wurtzite c-axis direction; removing said seed layer from said substrate; and growing said base layer on said bottom surface of said seed layer.

7. The method of claim 6 wherein said base layer is grown by molecular beam epitaxial growth.

8. The method of claim 6 wherein said substrate comprises sapphire and wherein said seed layer is removed by heating an interface between said seed layer and said substrate.

9. The method of claim 8 wherein said interface is heated by exposing said substrate to light of a wavelength that is absorbed by GaN but not by sapphire.

10. In a method for fabricating a semiconductor light emitting device comprising a plurality of semiconductor layers including an active layer between an n-type layer and a p-type layer, said active layer generating light by the recombination of holes and electrons, said active layer having a polarization field therein with a field direction that depends on the orientation of said active layer when said active layer is grown, the improvement comprising growing one of said plurality of semiconductor layers on a base layer such that said polarization field is directed from said n-layer to said p-layer,

wherein said semiconductor light emitting device comprises a substrate having a planar surface on which said layers are grown and wherein said active layer is grown on a surface that is tilted at an angle with respect to said substrate.

Assignments (9)
SECURITY INTEREST Recorded Oct 25, 2018
From: META COMPANY
To: VENTURE LENDING & LEASING VII, INC.; VENTURE LENDING & LEASING VIII, INC.
Reel/Frame 047322/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0528 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0518 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017207/0020 →