IP Library Granted Patent US 7,079,217
Granted Patent B2
US 7,079,217 · App. 10/026,760 · Granted Jul 18, 2006

Method of fabricating a liquid crystal display panel

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Quick Facts
Patent No.
US 7,079,217
App. No.
10/026,760
Granted
Jul 18, 2006
Kind
B2
Abstract

A method of fabricating a liquid crystal display panel includes preparing an upper substrate and a lower substrate, bonding the upper substrate to the lower substrate, cleaning exposed surfaces of the bonded upper and lower substrates, and eliminating the exposed surfaces of the bonded upper and lower substrates.

Claims (43)

1. A method of fabricating a liquid crystal display panel, comprising the steps of:

preparing an upper substrate and a lower substrate;

bonding the upper substrate to the lower substrate;

cleaning exposed surfaces of the bonded upper and lower substrates to remove foreign materials formed on the lower substrate during the preparing of the lower substrate; and

simultaneously eliminating the cleaned exposed surfaces of the bonded upper and lower substrates,

wherein the step of cleaning exposed surfaces includes dry-etching.

2. The method according to claim 1 , wherein the step of eliminating the exposed surfaces includes wet-etching.

3. The method according to claim 1 , further including the steps of:

forming a thin film transistor on the lower substrate;

forming a protective layer on the lower substrate; and

forming a pixel electrode on the protective layer to electrically contact the thin film transistor.

4. The method according to claim 3 , wherein the pixel electrode is formed of a transparent conductive material including one of indium-tin-oxide (ITO), indium-zinc-oxide (IZO), and indium-tin-zinc-oxide (ITZO).

5. The method according to claim 3 , wherein the protective layer is formed of an organic insulating material including one of an acrylic organic compound, fluorinated polymer, benzocyclobutene (BCB), and perfluorocyclobutane (PFCB).

6. The method according to claim 3 , wherein the step of forming the thin film transistor includes:

forming a gate electrode on the lower substrate;

forming a gate insulating film on the lower substrate to cover the gate electrode;

forming an active layer on the gate insulating film; and

forming a source electrode and a drain electrode on the active layer.

7. The method according to claim 6 , wherein the source electrode and drain electrode contact the gate insulating film.

8. The method according to claim 6 , wherein the pixel electrode contacts flat and inclined surfaces of the drain electrode via a contact hole to expose the drain electrode.

9. A method of fabricating a liquid crystal display panel, comprising the steps of:

bonding an upper substrate to a lower substrate;

cleaning exposed surfaces of the bonded upper and lower substrates to remove foreign materials formed on the lower substrate during preparation of the lower substrate; and

simultaneously removing the cleaned exposed surfaces of the bonded upper and lower substrates,

wherein the step of cleaning exposed surfaces includes dry-etching.

10. The method according to claim 9 , wherein the step of removing the exposed surfaces includes wet-etching.

11. The method according to claim 9 , wherein the step of removing the exposed surfaces uniformly reduces a thickness of the liquid crystal display panel.

12. A method of fabricating a liquid crystal display panel, comprising the steps of:

forming a gate electrode on a lower substrate;

forming a gate insulating film on the lower substrate to cover the gate electrode;

forming an active layer on the gate insulating film;

forming a source electrode and a drain electrode on the active layer;

forming a protective layer on the lower substrate;

bonding an upper substrate to the lower substrate;

cleaning exposed surfaces of the bonded upper and lower substrates to remove foreign materials formed on the lower substrate during the forming of the protective layer; and

simultaneously removing the cleaned exposed surfaces of the bonded upper and lower substrates,

wherein the step of cleaning exposed surfaces includes dry-etching.

13. The method according to claim 12 , wherein the step of removing the exposed surfaces includes wet-etching.

14. The method according to claim 12 , further including the step of forming a pixel electrode on the protective layer to electrically contact the drain electrode.

15. The method according to claim 14 , wherein the pixel electrode is formed of a transparent conductive material including one of indium-tin-oxide (ITO), indium-zinc-oxide (IZO), and indium-tin-zinc-oxide (ITZO).

16. The method according to claim 12 , wherein the protective layer is formed of an organic insulating material including one of an acrylic organic compound, fluorinated polymer, benzocyclobutene (BCB), and perfluorocyclobutane (PFCB).

17. The method according to claim 12 , wherein the step of removing the exposed surfaces uniformly reduces a thickness of the liquid crystal display panel.

18. The method according to claim 1 , wherein the step of simultaneously eliminating the exposed surfaces of the bonded upper and lower substrates uniformly reduces a thickness of the liquid crystal display panel.

Assignments (2)
CHANGE OF NAME Recorded Oct 17, 2008
From: LG. PHILIPS LCD CO., LTD.
To: LG DISPLAY CO., LTD.
Reel/Frame 021773/0029 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2001
From: LIM, BYOUNG HO
To: LG. PHILIPS LCD CO., LTD.
Reel/Frame 012413/0395 →