IP Library › Granted Patent US 6,921,505
Granted Patent B2
US 6,921,505 · App. 10/040,118 · Granted Jul 26, 2005

Hole filling using an etched hole-fill stand-off

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Quick Facts
Patent No.
US 6,921,505
App. No.
10/040,118
Granted
Jul 26, 2005
Kind
B2
Abstract

An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.

Claims (8)

1. A method of filling holes in a substrate having a plurality of holes to be filled comprising:

providing an etched hole-fill stand-off comprising missing a copper clad laminate with an image similar to that used to image a surface of the substrate, and subjecting the imaged laminate to develop-etch-ship processing to form a pattern in a copper surface of the laminate, the pattern having a plurality of holes, each of the plurality of holes corresponding to a hole to be filled of the substrate, the laminate holes being at least slightly larger in diameter than their corresponding substrate holes;

aligning the stand-off to a tooling plate;

aligning the substrate to the stand-off and placing the substrate in contact with the stand-off; and

filling the plurality of the holes of the substrate.

2. The method of claim 1 further comprising filling the boles of the substrate with a fill material such that the fill material extends at least partially into the holes of the stand-off.

3. The method of claim 2 further comprising removing the substrate from the stand-off wherein substantially all of the fill material extending into the stand-off remains after removal of the stand-off.

4. A method of claim 1 wherein filling the plurality of holes of the substrate utilizes a pressurized fill head while maintaining proper alignment between the plurality of holes in a substrate and holes of the stand-off.