Method of forming a dual-interface IC card and a card formed of such a method
View Patent ↗There is disclosed a method of forming a card embedded with an integrated circuit (IC) and an antenna coil, which method including the steps of (a) embedding an antenna coil onto a core sheet; (b) laminating the core sheet with a number of outer sheets to form a laminated panel; (c) forming a first cavity in the laminated panel to expose part of the antenna coil; (d) pulling out two ends of the antenna coil from the core sheet; and (e) securing the integrated circuit with the antenna coil, e.g. by soldering or thermo compression bonding.
1. A method of forming a card embedded with at least one integrated circuit and an antenna coil, said method including the steps of (a) embedding an antenna coil onto a core sheet; (b) laminating said core sheet with at least two outer sheets to form a laminated panel; (c) forming at least a first cavity in said laminated panel to expose part of said antenna coil; (d) pulling out at least one end of said antenna coil from said core sheet; and (e) securing said integrated circuit with said antenna coil.
2. A method according to claim 1 wherein, in said step (d), two ends of said antenna coil are pulled out from said core sheet.
3. A method according to claim 2 wherein said antenna coil is secured with said integrated circuit by soldering or thermo compression bonding.
4. A method according to claim 1 wherein said antenna coil is secured with said integrated circuit by soldering or thermo compression bonding.
5. A method according to claim 1 further including a step (f) of positioning a first part of said integrated circuit within said first cavity.
6. A method according to claim 5 further including a step (g) of forming a second cavity in said laminated panel to receive a second part of said integrated circuit.
7. A method according to claim 6 wherein said first cavity and said second cavity communicate with each other.
8. A method according to claim 7 wherein said second cavity is narrower than said first cavity.
9. A method according to claim 6 wherein said second cavity is narrower than said first cavity.
10. A method according to claim 1 including a step (h) of applying an adhesive material on at least part of said first cavity.
11. A method according to claim 1 further including a step (i) of removing an insulating coating from said end(s) of said antenna coil.