Wiring substrate manufacturing method
View Patent ↗A wiring substrate is manufactured in short TAT. Wirings of the wiring substrate are formed by an exposure treatment using a photomask which has shade patterns each containing at least nano particles and a binder.
1. A wiring substrate manufacturing method comprising a step of forming a wiring of a wiring substrate which forming step includes a projection exposure treatment in which exposure light from photomask is transmitted through a projection lens to pattern a photoresist, the photomask having a shade pattern formed on a plate, said shade pattern containing at least nanoparticles and a binder, the nano particles comprising black pigment and the method further including a step of forming each of said shade patterns on said plate by printing a shade material containing said black of about 30% or more.
2. The wiring substrate manufacturing method according to claim 1 , wherein said material contains said black pigment of 30% to 40%.
3. The wiring substrate manufacturing method according to claim 1 , wherein said shade pattern corresponds to said wirings, respectively.
4. The wiring substrate manufacturing method according to claim 1 , wherein an area of said shade pattern is smaller than an area of a light transmission region having no shade pattern.
5. The wiring substrate manufacturing method according to claim 1 , further comprising the steps of:
forming a line pattern for forming said wiring, in a thickness direction of a wiring substrate main body; and
forming a hole pattern which is a pattern for forming said wirings and which connects, to one another, line patterns located on difference wiring layers.
6. The wiring substrate manufacturing method according to claim 1 , wherein said nano particles consist of carbon.
7. The wiring substrate manufacturing method according to claim 1 , further comprising a step of mounting one or a plurality of electronic components on a first surface of said substrate.
8. The wiring substrate manufacturing method according to claim 7 , further comprising a step of mounting, while a second surface opposite to the first surface of said substrate faces a printed wiring substrate, the substrate on which said one or plurality of electronic components are mounted, on a printed wiring substrate.
9. The wiring substrate manufacturing method according to claim 1 , wherein the plate having said shade pattern formed thereon is a glass plate.
10. The wiring substrate manufacturing method according to claim 1 , wherein the nano-particles scatter light used by the exposure treatment.
11. The wiring substrate manufacturing method according to claim 10 , wherein the nanoparticles are 200 nm or less in particle diameter.
12. The wiring substrate manufacturing method according to claim 11 , wherein the binder comprises a resist material containing light absorber that absorbs exposure light.
13. The wiring substrate manufacturing method according to claim 1 , wherein the binder comprises a resist material containing light absorber that absorbs exposure light.
14. The wiring substrate manufacturing method according to claim 1 , wherein the shade pattern has a dimension on the order of μm.