IP Library Granted Patent US 6,916,187
Granted Patent B2
US 6,916,187 · App. 10/046,095 · Granted Jul 12, 2005

Ground connection structure, ground connecting member and ground connection method

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Quick Facts
Patent No.
US 6,916,187
App. No.
10/046,095
Granted
Jul 12, 2005
Kind
B2
Abstract

A ground connecting member is connected to a ground formed on a substrate. The ground connecting member has elasticity and conductivity. The substrate is fixed on a compensating member for compensating for an area of the ground. At this time, the ground connecting member is sandwiched between the substrate and the compensating member. In this structure, the ground connecting member contacts the compensating member, and electrically connects the ground with the compensating member in a low impedance state.

Claims (111)

1. A ground connection structure comprising:

a substrate, on whose surface a ground is formed;

a ground connecting member which is connected to said ground; and

a compensating member which compensates for an area of said ground and is joined to said substrate such that said ground connecting member is sandwiched between said compensating member and said substrate, wherein said ground connecting member:

extends from said substrate toward said compensating member; directly resiliently contacts said compensating member; and

electrically connects said ground with said compensating member in a low impedance state,

wherein said ground connecting member comprises: a base which is connected to said ground; and a spacer which is arranged on said base and has elasticity, and

wherein said compensating member is contacted directly by said spacer.

2. The ground connection structure according to claim 1 , wherein said base has at least one lead having a margin, left for being connected to said ground and formed in parallel with surface of said ground.

3. The ground connection structure according to claim 1 , wherein said spacer includes a plate spring.

4. The ground connection structure according to claim 1 , wherein said spacer includes a coil spring.

5. The ground connection structure according to claim 1 , wherein the entire structure of said ground connecting member is located on one side of said compensating member.

6. The ground connection structure according to claim 1 , wherein:

said substrate has at least one through-hole for fixing said ground connecting member on said substrate; and

said base includes at least one lead, which is inserted into the at least one through-hole and connected to said ground.

7. The ground connection structure according to claim 3 , wherein

said at least one lead has elasticity and a protruding portion for fixing said ground connecting member onto said substrate.

8. A ground connecting member, which is arranged between a substrate and a compensating member which compensates for an area of a ground formed on said substrate, and which electrically connects said ground and said compensating member, and said ground connecting member comprising:

a base which is connected to said ground; and

a spacer which is arranged on said base and has elasticity, wherein:

said spacer is in direct physical contact with said compensating member; and

said ground connecting member is sandwiched between said substrate and said compensating member, and electrically connects said ground and said compensating member in a low impedance state.

9. The ground connecting member according to claim 8 , wherein:

said substrate has at least one through-hole for fixing said ground connecting member onto said substrate;

said base has at least one lead to be inserted into the at least one through-hole; and

said at least one lead has elasticity and a protruding portion for fixing said ground connecting member onto said substrate.

10. The ground connecting member according to claim 8 , wherein

said base has at least one lead having a margin, left for being connected to said ground and being in parallel with surface of said ground.

11. The ground connecting member according to claim 8 , wherein

said spacer includes a plate spring.

12. The ground connecting member according to claim 8 , wherein

said spacer includes a coil spring.

13. The ground connection structure according to claim 8 , wherein the entire structure of said ground connecting member is located on one side of said compensating member.

14. A ground connection method comprising:

connecting a ground connecting member having elasticity and conductivity, to a ground formed on a substrate; and

arranging a compensating member for compensating for an area of said ground, on said substrate, wherein said ground connecting member;

extends from said substrate toward said compensating member;

directly resiliently contacts said compensating member, and

is sandwiched between the compensating member and said substrate, thereby electrically connecting said ground and said compensating member via said ground connecting member in a low impedance state;

wherein said ground connecting member comprises: a base which is connected to said ground; and a spacer which is arranged on said base and has elasticity; and wherein said spacer is in direct physical contact with said compensating member.

15. The ground connection method according to claim 14 , wherein the entire structure of said ground connecting member is located on one side of said compensating member.

16. A ground connection structure comprising:

a substrate, on whose surface a ground is formed;

a ground connecting member which is connected to said ground; and

a compensating member which compensates for an area of said ground and is joined to said substrate such that said ground connecting member is sandwiched between said compensating member and said substrate, wherein said ground connecting member;

extends from said substrate toward said compensating member;

directly resiliently contacts said compensating member; and

electrically connects said ground with said compensating member in a low impedance state, wherein

said ground connecting member comprises a base section and a spacer;

a plurality of leads project from said base section toward said substrate, and are electrically connected to said ground; and

said spacer is arranged between, and electrically connects, said base section and said compensating member, and has elasticity.

17. The ground connection structure according to claim 16 , wherein:

said base section comprises a generally planar portion extending generally in parallel to said substrate; and

said plurality of leads project orthogonally from said generally planar portion.

18. The ground connection structure according to claim 16 , wherein:

said ground is arranged on a side of said internal substrate adjacent to said compensating member; and

at least one of said plurality of leads comprises a tip part that extends generally orthogonally from said at least one of said plurality of leads to provide said electrical connection between said at least one of said plurality of leads and said ground.

19. The ground connection structure according to claim 16 , wherein:

said substrate further comprises through holes;

said ground is arranged on a side of said substrate opposite to said compensating member; and

said plurality of leads pass through said through holes to be electrically connected to said ground.

20. The ground connection structure according to claim 19 , wherein:

a distal end of at least one of said plurality of leads comprises a protruding section integral to said at least one of said plurality of leads;

when said plurality of leads pass through said through holes, said protruding section is arranged on a side of said substrate opposite to said base section, and mechanically fixes said substrate between said protruding section and said base section, so that no solder is required to connect said at least one of said plurality of leads to said ground.

21. A ground connection structure comprising:

a substrate, on whose surface a ground is formed;

a ground connecting member which is connected to said ground; and

a compensating member which compensates for an area of said ground and is joined to said substrate such that said ground connecting member is sandwiched between said compensating member and said substrate, and wherein said ground connecting member extends from said substrate toward said compensating member to resiliently contact said compensating member by being sandwiched between said substrate and said compensating member, and electrically connects said ground with said compensating member in a low impedance state; wherein:

said ground connecting member comprises a base which is connected to said ground and a spacer which is arranged on said base and has elasticity; and

wherein said compensating member is contacted directly by said spacer.

22. A ground connection structure comprising:

a substrate, on whose surface a ground is formed;

a ground connecting member which is connected to said ground; and

a compensating member which compensates for an area of said ground and is joined to said substrate such that said ground connecting member is sandwiched between said compensating member and said substrate, and wherein said ground connecting member extends from said substrate toward said compensating member to resiliently contact said compensating member by being sandwiched between said substrate and said compensating member, and electrically connects said ground with said compensating member in a low impedance state; wherein:

said ground connecting member comprises a base section and a spacer;

a plurality of leads project from said base section toward said substrate, and are electrically connected to said ground; and

said spacer is arranged between, and electrically connects, said base section and said compensating member, and has elasticity.

23. The ground connection structure according to claim 22 , wherein:

said base section comprises a generally planar portion extending generally in parallel to said substrate; and

said plurality of leads project orthogonally from said generally planar portion.

24. The ground connection structure according to claim 22 , wherein:

said substrate further comprises through holes;

said ground is arranged on a side of said substrate opposite to said compensating member; and

said plurality of leads pass through said through holes to be electrically connected to said ground.

25. The ground connection structure according to claim 22 , wherein:

a distal end of at least one of said plurality of leads comprises a protruding section integral to said at least one of said plurality of leads;

when said plurality of leads pass through said through holes, said protruding section is arranged on a side of said substrate opposite to said base section, and mechanically fixes said substrate between said protruding section and said base section, so that no solder is required to connect said at least one of said plurality of leads to said ground.

26. The ground connection structure according to claim 22 , wherein:

said ground is arranged on a side of said internal substrate adjacent to said compensating member; and

at least one of said plurality of leads comprises a tip part that extends generally orthogonally from said at least one of said plurality of leads to provide said electrical connection between said at least one of said plurality of leads and said ground.

27. A ground connecting member, which is arranged between a substrate and a compensating member which compensates for an area of a ground formed on said substrate, and which electrically connects said ground and said compensating member, and said ground connecting member comprising:

a base which is connected to said ground; and

a spacer which is arranged on said base and has elasticity; wherein

said spacer is in contact with said compensating member, in a state where said ground connecting member is sandwiched between said substrate and said compensating member, and electrically connects said ground and said compensating member in a low impedance state; and

said compensating member is contacted directly by said spacer.

28. A ground connection method comprising:

connecting a ground connecting member having elasticity and conductivity, to a ground formed on a substrate; and

arranging a compensating member for compensating for an area of said ground, on said substrate such that said ground connecting member extends from said substrate toward said compensating member to resiliently contact said compensating member and is sandwiched between the compensating member and said substrate, thereby electrically connecting said ground and said compensating member via said ground connecting member in a low impedance state, wherein said ground connecting member comprises a base which is connected to said ground and a spacer which is arranged on said base and has elasticity, and

said compensating member is contacted directly by said spacer.

29. A ground connection structure comprising:

a substrate, on whose surface a ground is formed;

a ground connecting member which is connected to said ground; and

a compensating member which compensates for an area of said ground and is joined to said substrate such that said ground connecting member is sandwiched between said compensating member and said substrate; wherein:

said ground connecting member comprises a proximal end fixed to said substrate, and an elastic distal end directly resiliently contacting said compensating member; and

said ground connecting member electrically connects said ground with said compensating member in a low impedance state.

30. A ground connection method comprising:

connecting a ground connecting member having elasticity and conductivity, to a ground formed on a substrate; and

arranging a compensating member for compensating for an area of said ground, on said substrate; wherein:

said ground connecting member comprises a proximal end fixed to said substrate, and a elastic distal end directly resiliently contacting said compensating member;

said ground connecting member is sandwiched between the compensating member and said substrate; and

said ground connecting member electrically connects said ground with said compensating member in a low impedance state.

Assignments (1)
CHANGE OF NAME Recorded Feb 3, 2015
From: NEC INFRONTIA CORPORATION
To: NEC PLATFORMS, LTD.
Reel/Frame 034881/0078 →