IP Library Patent Application 10047174
Patent Application Utility
App. No. 10/047,174 · Confirmation No. 4365

HIGH DENSITY CONNECTOR

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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2009-04-01 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-01-07 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-01-07 LET. Miscellaneous Incoming Letter 1 View
2004-01-07 DRW Drawings-only black and white line drawings 12 View
2002-01-14 TRNA Transmittal of New Application 5 View
2002-01-14 SPEC Specification 17 View
2002-01-14 CLM Claims 3 View
2002-01-14 ABST Abstract 1 View
2002-01-14 DRW Drawings-only black and white line drawings 10 View
2002-01-14 OATH Oath or Declaration filed 3 View
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Quick Facts
App. No.
10/047,174
Filed
2002-01-14
Granted
2004-03-02
Pub. No.
US20030134527A1
Art Unit
2831
PTA
-56 days