IP Library › Granted Patent US 7,413,929
Granted Patent B2
US 7,413,929 · App. 10/055,499 · Granted Aug 19, 2008

Integrated chip package structure using organic substrate and method of manufacturing the same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,413,929
App. No.
10/055,499
Granted
Aug 19, 2008
Kind
B2
Abstract

An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

Claims (105)

1. A method for fabricating a chip package, comprising:

joining a first side of a die and a substrate using an adhesive material;

after said joining said first side of said die and said substrate, forming a first polymer layer over a second side of said die, over said substrate and across an edge of said die, wherein said first and second sides are opposite to each other;

after said forming said first polymer layer, forming a circuit layer on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die, wherein said forming said circuit layer comprises a copper electroplating process, and wherein said circuit layer comprises a portion as a part of an inductor;

after said forming said circuit layer, forming a second polymer layer on said circuit layer, on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die;

after said forming said second polymer layer, forming a metal bump over said substrate, wherein said metal bump is connected to said die through said circuit layer; and

after said forming said metal bump, cutting said substrate.

2. A method for fabricating a chip package, comprising:

joining a first side of a die and a substrate using an adhesive material;

after said joining said first side of said die and said substrate, forming a first polymer layer over a second side of said die, over said substrate and across an edge of said die, wherein said first and second sides are opposite to each other;

after said forming said first polymer layer, forming a circuit layer on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die, wherein said forming said circuit layer comprises a copper electroplating process, and wherein said circuit layer comprises a portion as a part of a resistor;

after said forming said circuit layer, forming a second polymer layer on said circuit layer, on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die;

after said forming said second polymer layer, forming a metal bump over said substrate, wherein said metal bump is connected to said die through said circuit layer; and

after said forming said metal bump, cutting said substrate.

3. A method for fabricating a chip package, comprising:

joining a first side of a die and a substrate using an adhesive material;

after said joining said first side of said die and said substrate, forming a first polymer layer over a second side of said die, over said substrate and across an edge of said die, wherein said first and second sides are opposite to each other;

after said forming said first polymer layer, forming a circuit layer on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die, wherein said forming said circuit layer comprises a copper electroplating process, and wherein said circuit layer comprises a portion as a part of a waveguide;

after said forming said circuit layer, forming a second polymer layer on said circuit layer, on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die;

after said forming said second polymer layer, forming a metal bump over said substrate, wherein said metal bump is connected to said die through said circuit layer; and

after said forming said metal bump, cutting said substrate.

4. A method for fabricating a chip package, comprising:

joining a first side of a die and a substrate using an adhesive material;

after said joining said first side of said die and said substrate, forming a first polymer layer over a second side of said die, over said substrate and across an edge of said die, wherein said first and second sides are opposite to each other;

after said forming said first polymer layer, forming a circuit layer on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die, wherein said forming said circuit layer comprises a copper electroplating process, and wherein said circuit layer comprises a portion as a part of a capacitor;

after said forming said circuit layer, forming a second polymer layer on said circuit layer, on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die;

after said forming said second polymer layer, forming a metal bump over said substrate, wherein said metal bump is connected to said die through said circuit layer; and

after said forming said metal bump, cutting said substrate.

5. A method for fabricating a chip package, comprising:

joining a first side of a die and a substrate using an adhesive material;

after said joining said first side of said die and said substrate, forming a first polymer layer over a second side of said die, over said substrate and across an edge of said die, wherein said first and second sides are opposite to each other;

after said forming said first polymer layer, forming a circuit layer on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die, wherein said forming said circuit layer comprises a copper electroplating process, and wherein said circuit layer comprises a portion as a part of filter;

after said forming said circuit layer, forming a second polymer layer on said circuit layer, on said first polymer layer, over said second side of said die, over said substrate and across said edge of said die;

after said forming said second polymer layer, forming a metal bump over said substrate, wherein said metal bump is connected to said die through said circuit layer; and

after said forming said metal bump, cutting said substrate.

6. The method of claim 1 , wherein said second polymer layer comprises polyimide.

7. The method of claim 1 , wherein said second polymer layer comprises benzocyclobutene (BCB).

8. The method of claim 1 , wherein said substrate comprises a polymer.

9. The method of claim 1 , wherein said first polymer layer comprises polyimide.

10. The method of claim 1 , wherein said first polymer layer comprises benzocyclobutene (BCB).

11. The method of claim 1 , wherein said forming said first polymer layer comprises a curing process.

12. The method of claim 1 , wherein said forming said first polymer layer comprises a grinding process.

13. The method of claim 1 , wherein said forming said first polymer layer comprises an etching process.

14. The method of claim 1 , after said joining said first side of said die and said substrate, further comprising forming a third polymer layer over said substrate and surrounding said die, followed by said forming said first polymer layer further on said third polymer layer.

15. The method of claim 14 , wherein said forming said third polymer layer comprises a curing process.

16. The method of claim 14 , wherein said forming said third polymer layer comprises a grinding process.

17. The method of claim 14 , wherein said forming said third polymer layer comprises an etching process.

18. The method of claim 1 , wherein said cutting said substrate comprises a mechanical cutting process.

19. The method of claim 1 , wherein said forming said second polymer layer comprises a curing process.

20. The method of claim 1 , wherein said forming said second polymer layer comprises a grinding process.

21. The method of claim 1 , wherein said forming said second polymer layer comprises an etching process.

22. The method of claim 14 , wherein said third polymer layer comprises epoxy.

23. The method of claim 1 , wherein said forming said metal bump comprises forming a solder bump over said substrate.

24. The method of claim 1 , wherein said forming said metal bump comprises forming a gold bump over said substrate.

25. The method of claim 2 , wherein said first polymer layer comprises polyimide.

26. The method of claim 2 , wherein said forming said first polymer layer comprises a curing process.

27. The method of claim 2 , wherein said forming said first polymer layer comprises a grinding process.

28. The method of claim 2 , wherein said forming said first polymer layer comprises an etching process.

29. The method of claim 2 , wherein said second polymer layer comprises polyimide.

30. The method of claim 2 , after said joining said first side of said die and said substrate, further comprising forming a third polymer layer over said substrate and surrounding said die, followed by said forming said first polymer layer further on said third polymer layer.

31. The method of claim 30 , wherein said forming said third polymer layer comprises a curing process.

32. The method of claim 30 , wherein said forming said third polymer layer comprises a grinding process.

33. The method of claim 30 , wherein said forming said third polymer layer comprises an etching process.

34. The method of claim 2 , wherein said cutting said substrate comprises a mechanical cutting process.

35. The method of claim 2 , wherein said forming said metal bump comprises forming a solder bump over said substrate.

36. The method of claim 2 , wherein said forming said metal bump comprises forming a gold bump over said substrate.

37. The method of claim 2 , wherein said first polymer layer comprises benzocyclobutene (BCB).

38. The method of claim 30 , wherein said third polymer layer comprises epoxy.

39. The method of claim 2 , wherein said substrate comprises a polymer.

40. The method of claim 3 , wherein said first polymer layer comprises polyimide.

41. The method of claim 3 , wherein said forming said first polymer layer comprises a curing process.

42. The method of claim 3 , wherein said forming said first polymer layer comprises a grinding process.

43. The method of claim 3 , wherein said forming said first polymer layer comprises an etching process.

44. The method of claim 3 , wherein said second polymer layer comprises polyimide.

45. The method of claim 3 , after said joining first side of said die and said substrate, further comprising forming a third polymer layer over said substrate and surrounding said die, followed by said forming said first polymer layer further on said third polymer layer.

46. The method of claim 45 , wherein said forming said third polymer layer comprises a curing process.

47. The method of claim 45 , wherein said forming said third polymer layer comprises a grinding process.

48. The method of claim 45 , wherein said forming said third polymer layer comprises an etching process.

49. The method of claim 3 , wherein said cutting said substrate comprises a mechanical cutting process.

50. The method of claim 3 , wherein said forming said metal bump comprises forming a solder bump over said substrate.

51. The method of claim 3 , wherein said forming said metal bump comprises forming a gold bump over said substrate.

52. The method of claim 4 , wherein said first polymer layer comprises polyimide.

53. The method of claim 4 , wherein said forming said first polymer layer comprises a curing process.

54. The method of claim 4 , wherein said forming said first polymer layer comprises a grinding process.

55. The method of claim 4 , wherein said forming said first polymer layer comprises an etching process.

56. The method of claim 4 , wherein said second polymer layer comprises polyimide.

57. The method of claim 4 , said joining said first side of said die and said substrate, further comprising forming a third polymer layer over said substrate and surrounding said die, followed by said forming said first polymer layer further on said third polymer layer.

58. The method of claim 57 , wherein said forming said third polymer layer comprises a curing process.

59. The method of claim 57 , wherein said forming said third polymer layer comprises a grinding process.

60. The method of claim 57 , wherein said forming said third polymer layer comprises an etching process.

61. The method of claim 4 , wherein said cutting said substrate comprises a mechanical cutting process.

62. The method of claim 4 , wherein said forming said metal bump comprises forming a solder bump over said substrate.

63. The method of claim 4 , wherein said forming said metal bump comprises forming a gold bump over said substrate.

64. The method of claim 5 , wherein said first polymer layer comprises polyimide.

65. The method of claim 5 , wherein said forming said first polymer layer comprises a curing process.

66. The method of claim 5 , wherein said forming said first polymer layer comprises a grinding process.

67. The method of claim 5 , wherein said forming said first polymer layer comprises an etching process.

68. The method of claim 5 , wherein said second polymer layer comprises polyimide.

69. The method of claim 5 , after said joining said first side of said die and said substrate, further comprising forming a third polymer layer over said substrate and surrounding said die, followed by said forming said first polymer layer further on said third polymer layer.

70. The method of claim 69 , wherein said forming said third polymer layer comprises a curing process.

71. The method of claim 69 , wherein said forming said third polymer layer comprises a grinding process.

72. The method of claim 69 , wherein said forming said third polymer layer comprises an etching process.

73. The method of claim 5 , wherein said cutting said substrate comprises a mechanical cutting process.

74. The method of claim 5 , wherein said forming said metal bump comprises forming a solder bump over said substrate.

75. The method of claim 5 , wherein said forming said metal bump comprises forming a gold bump over said substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →
MERGER Recorded Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →