Method for manufacturing hybrid electronic circuits for active implantable medical devices
A method for manufacturing a plurality of hybrid electronic circuits for active implantable medical devices and circuits made by the process. The process includes the following stages: a) preparing a collective plane plate-substrate ( 10 ) carrying on a first surface a pattern of contact areas ( 16 ) for chips and, on a second surface (the back), a pattern of metallization areas for components, with a repetition of the same patterns for a corresponding plurality of circuits to be made from said substrate; b) gluing on the first surface of the plate of a plurality of chips ( 12, 14 ); c) cabling (wiring-bonding) the chips ( 12, 14 ) to their corresponding contact areas ( 16 ); d) pouring a coating resin over the first surface of the plate to achieve a uniform layer of coating resin ( 22 ), e) hardening the resin; f) cutting the plate to form the plurality of individual substrates, with each substrate having on its first surface coated chips, each one of these substrates corresponding to an implantable device individual circuit, and g) mounting SMC components ( 38, 40, 42 ) and/or connector elements ( 44 ) to the second surface of each individual substrate, so as to complete the electron circuits of the active implantable medical devices.
1. A method of manufacturing a plurality of hybrid electronic circuits for active implantable medical devices, comprising:
a) providing a flat collective plate-substrate comprising, on a first surface, a plurality of repeating patterns of a contact area for connection to at least one chip, and a second surface opposite the first surface having the plurality of repeating patterns of a metallization area for receiving at least one of an active SMC component, a passive SMC component, and a connector element, wherein said collective plate-substrate pluralities of contact areas and metallization areas correspond to a plurality of implantable device electronic circuits;
b) gluing on the first surface of the collective plate-substrate a second plurality of chips, wherein each of said implantable device electric circuits has at least one corresponding chip,
c) cabling each of said glued chips to an associated contact area,
d) pouring a coating resin over said first surface of the plate-substrate, and forming a uniform thickness layer of coating resin,
e) hardening the coating resin,
f) cutting the collective plate-substrate into a plurality of individual substrates, each substrate having on its first surface at least one glued chip coated by the resin, each individual substrate corresponding to an individual implantable device electric circuit; and
g) mounting at least one SMC component and/or a connector element to the second surface of each individual substrate, to form said plurality of electric circuits of the implantable devices.
2. The process of claim 1 , wherein the collective plate-substrate further comprises a peripheral marginal area and wherein stage d) further comprises spreading the resin over said peripheral area by gravity, and wherein stage f) further comprises cutting off the peripheral marginal area.
3. The process of claim 1 , further comprising, after stage e), depositing a uniform metal layer on the hardened coating resin layer.