IP Library Granted Patent US 7,112,818
Granted Patent B2
US 7,112,818 · App. 10/058,116 · Granted Sep 26, 2006

Semiconductor film transistor

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,112,818
App. No.
10/058,116
Granted
Sep 26, 2006
Kind
B2
Abstract

In accordance with the invention, the width of a gate electrode is smaller than the width of the semiconductor film. A sub gate electrode connected to the gate electrode is disposed, at the gate electrode side of the semiconductor film, away from the semiconductor film more than gate electrode. The width of the sub gate electrodes is larger than the width of the semiconductor film. Ends of the semiconductor film have regions formed of an intrinsic semiconductor which is not doped with dopant. In a semiconductor device, this structure is suitable to reduce degradation over time which is caused by an increase of the electric field strength or the carrier concentration at the ends of the semiconductor film.

Claims (26)

1. A semiconductor device, comprising:

a semiconductor film having a source region and a drain region;

a gate insulating film formed on at least part of the semiconductor film; and

a gate electrode formed on the gate insulating film,

a sub gate electrode connected to the gate electrode, and

a width of the gate electrode being smaller than a width of the semiconductor film,

the gate electrode not covering any end of the semiconductor film, and

the sub gate electrode being disposed so as to cover at least one end of the semiconductor film and so as to cover at least an entire width of the gate electrode.

2. The semiconductor device according to claim 1 , the sub gate electrode being disposed on the gate electrode.

3. The semiconductor device according to claim 1 ,

the semiconductor film being formed on an insulating layer.

4. The semiconductor device according to claim 1 , the width of the gate electrode being smaller than the width of the semiconductor film in the direction perpendicular to the source/drain direction.

5. A semiconductor device, comprising:

a semiconductor film having a plurality of source regions and drain regions, the semiconductor film including a plurality of regions formed of an intrinsic semiconductor which is not doped with dopant;

a gate insulating film formed on at least part of the semiconductor film; and

a gate electrode formed on the gate insulating film;

the regions extending toward at least one of the plurality of source regions and drain regions from the gate electrode and separating adjacent source regions and adjacent drain regions.

6. A semiconductor device, comprising:

a semiconductor film having a source region and a drain region;

a gate insulating film formed on at least part of the semiconductor film; and

a gate electrode formed on the gate insulating film,

a sub gate electrode connected to the gate electrode, and

a width of the gate electrode being smaller than a width of the semiconductor film,

the gate electrode not covering any end of the semiconductor film, and

the sub gate electrode being disposed so as to cover at least one end of the semiconductor film and so as to cover at least an entire width of the gate electrode.

7. The semiconductor device according to claim 6 , the width of the gate electrode being smaller than the width of the semiconductor film in the direction perpendicular to the source/drain direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2018
From: SEIKO EPSON CORPORATION
To: 138 EAST LCD ADVANCEMENTS LIMITED
Reel/Frame 046153/0397 →