IP Library › Granted Patent US 7,152,312
Granted Patent B2
US 7,152,312 · App. 10/073,701 · Granted Dec 26, 2006

Method for transmitting current through a substrate

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Quick Facts
Patent No.
US 7,152,312
App. No.
10/073,701
Granted
Dec 26, 2006
Kind
B2
Abstract

A method for transmitting high-frequency current through a substrate is provided. The method comprises receiving the high-frequency current at a via passing through at least one conductive plane disposed within the substrate and coupled to the via with one or more tabs which span a gap between the at least one conductive plane and the via; and directing the high-frequency current along an uninterrupted path substantially on a surface of the via thereby bypassing the at least one conductive plane by conducting at least a portion of the high-frequency current between the one or more tabs.

Claims (5)

1. A method for transmitting high-frequency current through a substrate, the method comprising:

receiving the high-frequency current at a via passing through at least one conductive plane disposed within the substrate and coupled to the via with one or more tabs which span a gap between the at least one conductive plane and the via; and

directing the high-frequency current along an uninterrupted path substantially on a surface of the via thereby bypassing the at least one conductive plane by conducting at least a portion of the high-frequency current between the one or more tabs.

2. The method of claim 1 , wherein receiving the current at the via comprises receiving the current from an electronic component disposed on the substrate.

3. The method of claim 1 , wherein receiving the high-frequency current at a via passing through at least one conductive plane disposed within a substrate comprises receiving the high-frequency current at a via passing through two or more conductive planes disposed within the substrate, each of the two or more conductive planes coupled to the via with one or more tabs which span a gap between each of the two or more conductive planes and the via, wherein at least a portion of one of the one or more tabs coupling one of the two or more conductive planes to the via is aligned with at least a portion of one of the one or more tabs coupling another of the two or more conductive planes to the via.

Assignments (6)
CHANGE OF NAME Recorded Apr 8, 2022
From: ADC DSL SYSTEMS, INC.
To: COMMSCOPE DSL SYSTEMS LLC
Reel/Frame 059644/0074 →
RELEASE OF SECURITY INTEREST IN PATENTS (RELEASES RF 036718/0042) Recorded Mar 31, 2017
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: COMMSCOPE DSL SYSTEMS LLC (FORMERLY KNOWN AS ADC DSL SYSTEMS, INC.)
Reel/Frame 042126/0050 →
PATENT SECURITY AGREEMENT - TERM LOAN Recorded Sep 29, 2015
From: ADC DSL SYSTEMS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 036714/0808 →
PATENT SECURITY AGREEMENT - ABL Recorded Sep 29, 2015
From: ADC DSL SYSTEMS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 036715/0164 →
PATENT SECURITY AGREEMENT Recorded Sep 29, 2015
From: ADC DSL SYSTEMS, INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, AS THE COLLATERAL AGENT
Reel/Frame 036718/0042 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2002
From: GOTTLIEB, GARY
To: ADC DSL SYSTEMS, INC.
Reel/Frame 012591/0541 →