Electronic device packaging
View Patent ↗A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.
1. A hermeticseal for an electronic circuit die comprising:
an inorganic layer for preventing moisture from reaching the electronic circuit die;
an organic layer outside the inorganic layer for protecting the inorganic layer; and
a plastic package.
2. The apparatus of claim 1 wherein the inorganic layer is outside the plastic package.
3. The apparatus of claim 2 wherein the inorganic layer is inside the plastic package.
4. A hermetic seal for an electronic circuit die comprising:
an inorganic layer for preventing moisture from reaching the electronic circuit die;
an organic layer outside the inorganic layer for protecting the inorganic layer;
a lead; and
a wire; wherein the inorganic layer contacts the lead.
5. A hermetic seal for an electronic circuit die comprising:
an inorganic layer for preventing moisture from reaching the electronic circuit die; and
an organic layer outside the inorganic layer for protecting the inorganic layer, the organic layer comprising a material consisting of para-xylyene, hybrid solgel, and polymeric materials.
6. A hermetically sealed device comprising:
an electronic circuit die;
an inorganic layer outside the electronic circuit die;
an organic layer outside the inorganic material;
a wire; and
a lead; wherein the inorganic layer contacts the lead.
7. A hermetically sealed device comprising:
an electronic circuit die;
an inorganic layer outside the electronic circuit die; and
an organic layer outside the inorganic material, the organic layer comprising a material consisting of para-xylyene, hybrid solgel, and polymeric materials.
8. A hermetically sealed device comprising:
an electronic circuit die;
an inorganic layer outside the electronic circuit die;
an organic layer outside the inorganic material;
a wire;
a lead; and
a plastic package.
9. The hermetically sealed device of claim 8 wherein the plastic package contacts the inorganic layer.
10. The hermetically sealed device of claim 8 wherein the plastic package contacts the organic layer.