Apparatus for making embossed blister pack
View Patent ↗The invention herein relates to a method and apparatus for forming (or cold-forming) an embossed blister from a laminated film wherein an indicia is formed on the base of the blister. In particular, the invention involves a single pass process of combining the formation of a blister and the formation of an indicia (embossing) on the blister, wherein the blister-forming pin contains a face with an indicia and is adapted to controllably stretch the laminated film during blister formation to minimize stretching of the film at the base of the blister. The invention is particularly useful in manufacturing processes which involve the formation of blisters having laminated films which contain a metal foil and polymer layer, wherein improved control in the stretching of the laminate during blister formation is desirable.
1. A pharmaceutical packaging apparatus for making an embossed blister formed from a laminated plastic film comprising:
(a) a pin having a body and face portion, said face having indicia thereon and said pin body being structured to progressively engage the film from the pin face and comprising at least two frusto-conical portions having different apex angles, said pin face comprising a slightly concave surface having a peripheral edge and wherein said pin body adjacent to said pin face comprises different materials having differing friction parameters with said film.
(b) a platen bearing an indicia forming die therein and structured to accommodate a laminated plastic film thereon wherein said platen is in a base which is not configured to form a mold against which the laminated film is contoured; and
(c) means for advancing said pin towards and in engagement with said platen; wherein said pin indicia and platen indicia are complementary and said pin is positioned transversely to said platen and structured to controllably stretch said film located at the base of said blister; and
wherein said apparatus is structured to accomplish both embossing and blister formation within a single pass of pin advancement onto said film.