Heat sink apparatus with air duct
View Patent ↗A heat dissipating apparatus. In one embodiment, a heat dissipating apparatus is comprised of a heat sink device having a plurality of cooling fins coupled to the heat sink device. The heat sink device is adapted to be thermally coupled to a heat source. The plurality of cooling fins are adapted to dissipate heat generated by the heat source. An air duct is coupled with the heat sink device. The air duct is for directing an airflow to the cooling fins to increase dissipation of the heat.
1. A heat dissipating apparatus comprising:
a heat sink device having a plurality of cooling fins coupled thereto, said heat sink device adapted to be thermally coupled with a heat source, said plurality of cooling fins adapted to dissipate heat generated by said heat sources and wherein said plurality of cooling fins are disposed in a first region and a second region, wherein said plurality of cooling fins in said first region generate less resistance to said airflow than is generated by said plurality of cooling fins in said second region, an air duct coupled with said heat sink device, said air duct for directing an airflow to said cooling fins to increase dissipation of said heat wherein said air duct directs said airflow through said first region of said plurality of cooling fins, and subsequently through said second region of said plurality of cooling fins; and
a plurality of upstream fins coupled with said air duct, said plurality of upstream fins upstream of said plurality of cooling fins, said plurality of upstream fins not connected to said heat sink and for providing direction to said airflow with respect to said plurality of cooling fins.
2. The heat dissipating apparatus of claim 1 wherein said second region of said plurality of cooling fins are disposed thermally proximal to said heat source.
3. The heat dissipating apparatus of claim 2 wherein said plurality of upstream fins direct said airflow away from said first region of said plurality of cooling fins and toward said second region of said plurality of cooling fins disposed thermally proximal to said heat source.
4. The heat dissipating apparatus of claim 1 wherein the pitch of said second region of said plurality of cooling fins is finer than the pitch of said first region of said plurality of cooling fins.
5. A heat dissipating apparatus comprising:
a heat sink device having a plurality of cooling fins, said plurality of cooling fins comprising a first region of cooling fins and a second region of cooling fins, said plurality of cooling fins coupled with said heat sink device, said heat sink device adapted to be thermally coupled with a heat source, said plurality of cooling fins adapted to dissipate heat generated by said heat source;
an air duct coupled with said heat sink device, said air duct for directing an airflow to said plurality of cooling fins, said airflow directed through said first region of cooling fins and subsequently through said second region of cooling fins, wherein said first region of cooling fins generate less resistance to said airflow than said second region of cooling fins and wherein said first region of cooling fins are disposed in an airflow resistance minimizing pattern; and
a plurality of upstream fins coupled with said air duct, said plurality of upstream fins upstream of said plurality of cooling fins, said plurality of upstream fins not connected to said heat sink device and for providing direction to said airflow with respect to said plurality of cooling fins.
6. The heat dissipating apparatus of claim 5 wherein said second region of cooling fins are disposed thermally proximal to said heat source.
7. The heat dissipating apparatus of claim 6 wherein said plurality of upstream fins direct said airflow away from said first region of said plurality of cooling fins and toward said second region of said plurality of cooling fins disposed thermally proximal to the hottest portion of said heat source.
8. A heat dissipating apparatus comprising:
a heat sink device having a plurality of cooling fins coupled thereto, said heat sink device adapted to be thermally coupled with a heat source, said plurality of cooling fins adapted to dissipate heat generated by said heat source, and wherein said plurality of cooling fins are disposed in a first region and a second region, an air duct coupled with said heat sink device, said air duct for directing an airflow to said cooling fins to increase dissipation of said heat wherein said air duct directs said airflow through said first region of said plurality of cooling fins, and subsequently through said second region of said plurality of cooling fins, and wherein the pitch of said second region of said plurality of cooling fins is finer than the pitch of said first region of said plurality of cooling fins; and
a plurality of upstream fins coupled with said air duct, said plurality of upstream fins upstream of said plurality of cooling fins, said plurality of upstream fins not connected to said heat sink and for providing direction to said airflow with respect to said plurality of cooling fins.
9. The heat dissipating apparatus of claim 8 wherein said plurality of cooling fins in said first region generate less resistance to said airflow than is generated by said plurality of cooling fins in said second region.
10. The heat dissipating apparatus of claim 8 wherein said second region of said plurality of cooling fins are disposed thermally proximal to said heat source.
11. The heat dissipating apparatus of claim 10 wherein said plurality of upstream fins direct said airflow away from said first region of said plurality of cooling fins and toward said second region of said plurality of cooling fins disposed thermally proximal to said heat source.