IP Library › Granted Patent US 6,682,635
Granted Patent Utility
US 6,682,635 · Confirmation No. 1849

CATHODIC SPUTTERING CHAMBER FOR APPLYING MATERIAL TO THE SURFACE OF A SEMICONDUCTOR WAFER LOCATED THEREIN

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2003-11-26 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-02-28 TRNA Transmittal of New Application 3 View
2002-02-28 SPEC Specification 8 View
2002-02-28 CLM Claims 2 View
2002-02-28 ABST Abstract 1 View
2002-02-28 DRW Drawings-only black and white line drawings 2 View
2002-02-28 OATH Oath or Declaration filed 4 View
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Quick Facts
Patent No.
US 6,682,635
App. No.
10/085,446
Filed
2002-02-28
Granted
2004-01-27
Pub. No.
US20020162739A1
Art Unit
1753
PTA
-33 days