High frequency apparatus
View Patent ↗A tuning door is fabricated for a resonant cavity of a high frequency apparatus. Contact fingers are formed around the edge of a conductive plate. The plate is then fixed to a support by, for example, double sided adhesive tape. The conductive plate is part of the interior surface of the resonant cavity. The fingers may be formed in one operation, for example, by photoetching and are fully integral with the active surface to give optimum electrical conduction between them. Other types of high frequency apparatus may use contact fingers to provide electrical conduction between a movable wall and an adjacent conductive surface.
1. A high frequency apparatus, comprising:
a) a movable wall having a support which carries an electrical conductive plate, and being an active surface during use, the support having substantially the same area and shape as that of the conductive plate; and
b) a plurality of contact fingers at a periphery of the movable wall and being integral with the conductive plate, the contact fingers being arranged to extend behind the support.
2. The apparatus as claimed in claim 1 , wherein the support is a framework.
3. The apparatus as claimed in claim 1 , wherein the movable wall is a tuning door for a resonant cavity.
4. The apparatus as claimed in claim 1 , wherein the conductive plate is constituted of beryllium copper.
5. The apparatus as claimed in claim 1 , wherein the conductive plate is gold plated.
6. The apparatus as claimed in claim 1 , wherein the conductive plate is silver plated.
7. A high frequency apparatus, comprising:
a) a movable wall having a support which carries an electrical conductive plate, and being an active surface during use, the active surface of the movable wall being defined by a single conductive plate; and
b) a plurality of contact fingers at a periphery of the movable wall and being integral with the conductive plate, the contact fingers being arranged to extend behind the support.
8. A high frequency apparatus, comprising:
a) a movable wall having a support which carries an electrical conductive plate, and being an active surface during use; and
b) a plurality of contact fingers at a periphery of the movable wall and being integral with the conductive plate, the contact fingers being arranged to extend behind the support, the contact fingers being arranged around the entire periphery of the movable wall.
9. A high frequency apparatus, comprising:
a) a movable wall having a support which carries an electrical conductive plate, and being an active surface during use, the conductive plate being fixed to the support by an adhesive; and
b) a plurality of contact fingers at a periphery of the movable wall and being integral with the conductive plate, the contact-fingers being arranged to extend behind the support.
10. The apparatus as claimed in claim 9 , wherein the conductive plate is fixed to the support by an adhesive tape.
11. A method of manufacturing a movable wall for a high frequency apparatus, comprising the steps of:
a) taking a plate of a conductive material;
b) forming contact fingers at a periphery of the plate by photoetching; and
c) then mounting the plate on a support, and arranging the contact fingers to extend behind the support.
12. The method as claimed in claim 11 , wherein the plate is constituted of beryllium copper.
13. The method as claimed in claim 11 , and the step of plating the plate with gold.
14. The method as claimed in claim 11 , and the step of plating the plate with silver.
15. A method of manufacturing a movable wall for a high frequency apparatus, comprising the steps of:
a) taking a plate of a conductive material;
b) forming contact fingers at a periphery of the plate; and
c) then mounting the plate on a support by fixing the plate to the support by an adhesive, and arranging the contact fingers to extend behind the support.
16. The method as claimed in claim 15 , and the step of fixing the plate to the support by an adhesive tape.