IP Library Granted Patent US 7,030,434
Granted Patent B1
US 7,030,434 · App. 10/089,570 · Granted Apr 18, 2006

Arrangement with image sensors

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Quick Facts
Patent No.
US 7,030,434
App. No.
10/089,570
Granted
Apr 18, 2006
Kind
B1
Abstract

A memory transistor and a selection transistor of an image sensor are connected in series and between a bit line (B 5 ) and a reference line (R 5 ). A gate electrode of the selection transistor is connected to a word line (W 5 ), which extends crosswise in relation to the bit line (B 5 ). A diode of the image sensor is switched between a gate electrode (G 5 ) of the memory transistor and a first source/drain area (S/D 5 ) of the memory transistor, which is connected to the selection transistor in such a way is polarized towards the first source/drain area (S/D 5 ) of the memory transistor and in the reverse direction. A photodiode of the image sensor is switched between a voltage connection and either the gate electrode (G 5 ) of the memory transistor or the first source/drain area (S/D 5 ) of the memory transistor in such a way that it is polarized towards the voltage connection and in the reverse direction.

Claims (46)

1. Arrangement with image sensors,

in which an image sensor has a memory transistor and a selection transistor, which are connected in series and between a bit line or a reference line,

in which a gate electrode of the selection transistor is connected to a word line, which extends crosswise in relation to the bit line,

in which the image sensor has a diode, which is switched between a gate electrode of the memory transistor and a first source/drain area of the memory transistor, which is connected to the selection transistor in such a way that it is polarised towards the first source/drain area of the memory transistor and in the reverse direction,

in which the image sensor has a photodiode, which is switched between a voltage connection and the gate electrode of the memory transistor in such a way that it is polarised towards the voltage connection and in the reverse direction.

2. Arrangement with image sensors,

in which an image sensor has a memory transistor and a selection transistor, which are connected in series and between a bit line and a reference line,

in which one gate electrode of the selection transistor is connected to a word line, which extends crosswise in relation to the bit line,

in which an image sensor has a diode, which is switched between a gate electrode of the memory transistor and a first source/drain area of the memory transistor, which is connected to the selection transistor in such a way that it is polarised towards the first source/drain area of the memory transistor and in the reverse direction,

in which an image sensor has a photodiode, which is switched between a voltage connection and the first source/drain area of the memory transistor in such a way that it is polarised towards the voltage connection and in the reverse direction.

3. Arrangement according to claim 1 ,

in which the photodiode consists of a n-doped area and a p-doped area adjacent to this, which is connected to the voltage connection.

4. Arrangement according to claim 3 ,

in which the n-doped area of the photodiode, the first source/drain area of the memory transistor and/or a first source/drain area of the selection transistor from a cohesive doped area.

5. Arrangement according to claim 1 ,

in which the memory transistor is designed as a vertical transistor,

in which the first source/drain area of the memory transistor is arranged over a second source/drain area of the memory transistor, which is connected to the reference line,

in which the reference line is buried in the substrate.

6. Arrangement according to claim 1 ,

in which the diode is designed as a tunnel diode and consists of the first source/drain area of the memory transistor, an insulating layer adjacent to this and a conductive structure adjacent to this, which is connected to the gate electrode of the memory transistor.

7. Arrangement according to claim 6 ,

in which one substrate has a recess,

in which the recess extends into the reference line,

in which at least one lateral face of an upper area of the recess is provided with the insulating layer,

in which faces of a lower area of the recess lying below the upper part are equipped with a gate insulator,

in which the gate electrode of the memory transistors is arranged in the lower part,

in which the conductive structure of the diode arranged is in the upper part of the recess,

in which the first source/drain area of the memory transistor is arranged in the substrate and is adjacent to the lateral face of the upper area.

8. Arrangement according to claim 2 ,

in which the photodiode consists of a n-doped area and a p-doped area adjacent to this, which is connected to the % voltage connection.

9. Arrangement according to claim 8 ,

in which the n-doped area of the photodiode, the first source/drain area of the memory transistor and/or a first source/drain area of the selection transistor form a cohesive doped area.

10. Arrangement according to claim 2 ,

in which the memory transistor is designed as a vertical transistor,

in which the first source/drain area of the memory transistor is arranged over a second source/drain area of the memory transistor, which is connected to the reference line,

in which the reference line is buried in the substrate.

11. Arrangement according to claim 2 ,

in which the diode is designed as a tunnel diode and consists of the first source/drain area of the memory transistor, an insulating layer adjacent to this and a conductive structure adjacent to this, which is connected to the gate electrode of the memory transistor.

12. Arrangement according to claim 11 ,

in which one substrate has a recess,

in which the recess extends into the reference line,

in which at least one lateral face of an upper area of the recess is provided with the insulating layer,

in which faces of a lower area of the recess lying below the upper part are equipped with a gate insulator,

in which the gate electrode of the memory transistors is arranged in the lower part,

in which the conductive structure of the diode arranged is in the upper part of the recess,

in which the first source/drain area of the memory transistor is arranged in the substrate and is adjacent to the lateral face of the upper area.

Assignments (8)
SECURITY AGREEMENT Recorded Jul 9, 2021
From: MAXLINEAR, INC.; MAXLINEAR COMMUNICATIONS, LLC; EXAR CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 056816/0089 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2020
From: INTEL CORPORATION
To: MAXLINEAR, INC.
Reel/Frame 053626/0636 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2020
From: LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: INTEL CORPORATION
Reel/Frame 053259/0678 →
MERGER AND CHANGE OF NAME Recorded Jan 17, 2018
From: LANTIQ DEUTSCHLAND GMBH; LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 045086/0015 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 025413/0340 AND 025406/0677 Recorded Apr 17, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LANTIQ BETEILIGUNGS-GMBH & CO. KG
Reel/Frame 035453/0712 →
GRANT OF SECURITY INTEREST IN U.S. PATENTS Recorded Nov 29, 2010
From: LANTIQ DEUTSCHLAND GMBH
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 025406/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 15, 2010
From: INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
To: LANTIQ DEUTSCHLAND GMBH
Reel/Frame 024529/0593 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2010
From: INFINEON TECHNOLOGIES AG
To: INFINEON TECHNOLOGIES WIRELESS SOLUTIONS GMBH
Reel/Frame 024483/0021 →