IP Library Granted Patent US 6,898,096
Granted Patent B2
US 6,898,096 · App. 10/091,405 · Granted May 24, 2005

Semiconductor integrated circuit with voltage generation circuit, liquid crystal display controller and mobile electric equipment

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Quick Facts
Patent No.
US 6,898,096
App. No.
10/091,405
Granted
May 24, 2005
Kind
B2
Abstract

There is to be provided a liquid crystal drive controller with a built-in power supply circuit wherein latch-up is made difficult to arise even if one amplitude level of the segment line drive voltage is set to the ground potential and the levels of other liquid crystal drive voltages are determined accordingly. A semiconductor integrated circuit with a built-in power supply circuit, wherein a negative voltage generated in a power supply circuit is applied to a substrate or a well region as a bias voltage, is provided with a switch for temporarily applying the ground potential to the substrate or well region to be biased with the negative voltage at the time of starting up the power supply circuit.

Claims (18)

1. A semiconductor integrated circuit having built-in power supply circuit which, receiving an external source voltage, generates a positive voltage higher than the external source voltage and a negative voltage lower than a ground potential, the semiconductor integrated circuit comprising:

a switch element connected between a first wiring for feeding the negative voltage as a bias voltage for a substrate and a second wiring for supplying the ground potential.

2. The semiconductor integrated circuit according to claim 1 , wherein the switch element is temporarily made to conduct at a time of starting up the built-in power supply circuit to set potential of the substrate, to which the negative voltage is to be applied, temporarily to the ground potential.

3. The semiconductor integrated circuit according to claim 2 , further comprising:

a reset circuit for generating a control signal to make the switch element conduct temporarily in accordance with another control signal for starting up the built-in power supply circuit.

4. The semiconductor integrated circuit according to claim 1 , wherein the switch element is comprised of a high voltage withstand MOSFET.

5. The semiconductor integrated circuit according to claim 1 ,

wherein the substrate is a semiconductor substrate of a first conductivity type,

wherein the semiconductor integrated circuit includes:

a first MOSFET of a first channel type having a source region of a second conductivity type different from the first conductivity type and a drain region of the second conductivity type, both of which are formed in the semiconductor substrate of the first conductivity type.

6. The semiconductor integrated circuit according to claim 5 , wherein the semiconductor integrated circuit further includes:

a first well region of the second conductivity type formed in the semiconductor substrate of the first conductivity type, and

a second MOSFET of a second channel type having a source region of the first conductivity type and a drain region of the first conductivity type and a drain region of the first conductivity type, both of which are formed in the first well region.

7. The semiconductor integrated circuit according to claim 6 , wherein the semiconductor integrated circuit further includes:

a second well region of the second conductivity type formed in the semiconductor substrate of the first conductivity type,

a third MOSFET of the second channel type having a source region of the first conductivity type and a drain region of the first conductivity type, both of which are formed in the third well region,

a third well region of the first conductivity type formed in the second well region, and

a forth MOSFET of the first channel type having a source region of the second conductivity type and a drain region of the second conductivity type, both of which are formed in the third well region.

Assignments (10)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2024
From: SYNAPTICS JAPAN GK
To: SYNAPTICS INCORPORATED
Reel/Frame 067793/0211 →
SECURITY INTEREST Recorded Sep 27, 2017
From: SYNAPTICS INCORPORATED
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 044037/0896 →
CHANGE OF NAME Recorded Aug 8, 2016
From: SYNAPTICS DISPLAY DEVICES GK
To: SYNAPTICS JAPAN GK
Reel/Frame 039711/0862 →
CHANGE OF NAME Recorded May 29, 2015
From: RENESAS SP DRIVERS INC.
To: SYNAPTICS DISPLAY DEVICES KK
Reel/Frame 035796/0947 →
CHANGE OF NAME Recorded May 29, 2015
From: SYNAPTICS DISPLAY DEVICES KK
To: SYNAPTICS DISPLAY DEVICES GK
Reel/Frame 035797/0036 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2014
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS SP DRIVERS INC.
Reel/Frame 033778/0137 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2014
From: HITACHI DEVICE ENGINEERING CO., LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 033306/0475 →
MERGER AND CHANGE OF NAME Recorded Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014598/0211 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2003
From: ENDO, KAZUYA; MIYAMOTO, NAOKI; MIZUNO, TOSHIO; NAKAJI, TAKAYUKI; UCHIDA, TAKATOSHI; OOKADO, KAZUO; YOKOTA, YOSHIKAZU
To: HITACHI, LTD.; HITACHI DEVICE ENGINEERING CO., LTD.
Reel/Frame 014514/0139 →