IP Library Patent Application 10093801
Patent Application Utility
App. No. 10/093,801 · Confirmation No. 2970

METHOD FOR EVALUATING MOLDING MATERIAL WITH DAMS FORMED ON A SEMICONDUCTOR SUBSTRATE TO DEFINE SLITS FOR CAPTURING FILLERS CONTAINED IN THE MOLDING MATERIAL

Inventor: Masaru Takahara
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
⬇ PDF
Code Description Pages PDF
2002-03-11 TRNA Transmittal of New Application 2 View
2002-03-11 A.PE Preliminary Amendment 26 View
2002-03-11 SPEC Specification 9 View
2002-03-11 CLM Claims 8 View
2002-03-11 ABST Abstract 1 View
2002-03-11 DRW Drawings-only black and white line drawings 4 View
2002-03-11 OATH Oath or Declaration filed 4 View
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Quick Facts
App. No.
10/093,801
Filed
2002-03-11
Granted
2002-12-31
Pub. No.
US20020088974A1
Art Unit
2813
PTA
0 days