IP Library Granted Patent US 7,013,019
Granted Patent B2
US 7,013,019 · App. 10/093,878 · Granted Mar 14, 2006

Thermoset composite material baffle for loudspeaker

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Quick Facts
Patent No.
US 7,013,019
App. No.
10/093,878
Granted
Mar 14, 2006
Kind
B2
Abstract

This invention provides a baffle formed from a thermoset composite material such as Bulk Molding Compound (BMC), Thick Molding Compound (TMC), or Sheet Molding Compound (SMC). Due to the physical properties of BMCs, TMCs, and SMCs, the baffle may be molded to minimize the propagation of vibrational energy and resonant mode behavior while providing high strength and rigidity. The baffle may also be formed so transducer mounts, ports and wave-guides may be molded into the baffle shape.

Claims (51)

1. A loudspeaker system, comprising:

a baffle having an opening adapted to receive a transducer, where the baffle is molded from a thermoset composite material; and

a wave-guide molded into the baffle adjacent to the opening and on the top side of the opening, the opening having a circular configuration such that a bottom section of the wave-guide extends along an arc substantially defined by the circular configuration of the opening adapted to receive the transducer.

2. The loudspeaker system according to claim 1 , where the thermoset composite material comprises a polyester resin.

3. The loudspeaker system according to claim 2 , where the polyester resin is in a styrene monomer form.

4. The loudspeaker system according to claim 1 , where the thermoset composite material comprises a vinylester resin.

5. The loudspeaker system according to claim 4 , where the vinylester resin is in a styrene monomer form.

6. The loudspeaker system according to claim 1 , where the baffle is molded to form a wave-guide.

7. The loudspeaker system according to claim 6 , where the wave-guide is a high frequency wave-guide.

8. The loudspeaker system according to claim 1 , where the baffle is molded to form at least one port.

9. The loudspeaker system according to claim 1 , where the thermoset composite material comprises a thick molding compound (TMC).

10. The loudspeaker system according to claim 9 , where the thermoset composite material further comprises a filler.

11. The loudspeaker system according to claim 10 , where the filler comprises rubber.

12. The loudspeaker system according to claim 10 , where the filler comprises glass.

13. The loudspeaker system according to claim 10 , where the filler comprises calcium carbonate.

14. The loudspeaker system according to claim 10 , where the filler comprises mica.

15. The loudspeaker system according to claim 10 , where the filler comprises wood flour.

16. The loudspeaker system according to claim 10 , where the thermoset composite material further comprises a fire retarding agent.

17. The loudspeaker system according to claim 16 , where the fire retarding agent comprises aluminum trihydrate.

18. The loudspeaker system according to claim 10 , where the thermoset composite material further comprises a mold-releasing agent.

19. The loudspeaker system according to claim 10 , where the thermoset composite material further comprises a colorizing agent.

20. The loudspeaker system according to claim 1 , where the thermoset composite material comprises a sheet-molding compound (SMC).

21. The loudspeaker system according to claim 20 , where the SMC further comprises a filler.

22. The loudspeaker system according to claim 21 , where the filler comprises rubber.

23. The loudspeaker system according to claim 21 , where the filler comprises glass.

24. The loudspeaker system according to claim 21 , where the filler comprises calcium carbonate.

25. The loudspeaker system according to claim 21 , where the filler comprises mica.

26. The loudspeaker system according to claim 21 , where the filler comprises sawdust.

27. The loudspeaker system according to claim 20 , where SMC further comprises a fire retarding agent.

28. The loudspeaker system according to claim 27 , where the fire retarding agent comprises aluminum trihydrate.

29. The loudspeaker system according to claim 20 , where the SMC further comprises a mold-releasing agent.

30. The loudspeaker system according to claim 20 , where the SMC further comprises a colorizing agent.

31. The loudspeaker system according to claim 1 , where the thermoset composite material comprises a bulk-molding compound (BMC).

32. The loudspeaker system according to claim 31 , where the TMC further comprises a filler.

33. The loudspeaker system according to claim 31 , where the filler comprises rubber.

34. The loudspeaker system according to claim 31 , where the filler comprises glass.

35. The loudspeaker system according to claim 31 , where the filler comprises calcium carbonate.

36. The loudspeaker system according to claim 31 , where the filler comprises mica.

37. The loudspeaker system according to claim 31 , where the filler comprises sawdust.

38. The loudspeaker system according to claim 30 , where BMC further comprises a fire retarding agent.

39. The loudspeaker system according to claim 38 , where the fire retarding agent comprises aluminum trihydrate.

40. The loudspeaker system according to claim 30 , where the BMC further comprises a mold-releasing agent.

41. The loudspeaker system according to claim 30 , where the BMC further comprises a colorizing agent.

42. The loudspeaker system according to claim 1 , where the baffle is molded to form a second opening for mounting a mid range transducer.

43. A loudspeaker system, comprising:

a baffle molded from a thermoset composite material;

a wave-guide and an opening formed into the molded baffle, the opening adapted to mount a transducer, where the wave-guide molded into the baffle is adjacent to the opening and on the top side of the opening, the opening has a circular configuration such that a bottom section of the wave-guide extends along an arc substantially defined by the circular configuration of the opening adapted to receive the transducer; and

a loudspeaker enclosure adapted to couple with the baffle.

44. The loudspeaker system according to claim 43 , where the thermoset composite material comprises a thick molding compound (TMC).

45. The loudspeaker system according to claim 43 , where the thermoset composite material comprises a sheet-molding compound (SMC).

46. The loudspeaker system according to claim 43 , where the thermoset composite material comprises a bulk-molding compound (BMC).

Assignments (6)
RELEASE Recorded Nov 14, 2012
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED; HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH
Reel/Frame 029294/0254 →
SECURITY AGREEMENT Recorded Feb 17, 2011
From: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED; HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025823/0354 →
RELEASE Recorded Feb 15, 2011
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED; HARMAN BECKER AUTOMOTIVE SYSTEMS GMBH
Reel/Frame 025795/0143 →
SECURITY AGREEMENT Recorded May 8, 2009
From: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED; BECKER SERVICE-UND VERWALTUNG GMBH; CROWN AUDIO, INC.; HARMAN BECKER AUTOMOTIVE SYSTEMS (MICHIGAN), INC.; HARMAN BECKER AUTOMOTIVE SYSTEMS HOLDING GMBH; HARMAN BECKER AUTOMOTIVE SYSTEMS, INC.; HARMAN CONSUMER GROUP, INC.; HARMAN DEUTSCHLAND GMBH; HARMAN FINANCIAL GROUP LLC; HARMAN HOLDING GMBH & CO. KG; HARMAN MUSIC GROUP, INCORPORATED; HARMAN SOFTWARE TECHNOLOGY INTERNATIONAL BETEILIGUNGS GMBH; HARMAN SOFTWARE TECHNOLOGY MANAGEMENT GMBH; HBAS INTERNATIONAL GMBH; HBAS MANUFACTURING, INC.; INNOVATIVE SYSTEMS GMBH NAVIGATION-MULTIMEDIA; JBL INCORPORATED; LEXICON, INCORPORATED; MARGI SYSTEMS, INC.; QNX SOFTWARE SYSTEMS (WAVEMAKERS), INC.; QNX SOFTWARE SYSTEMS CANADA CORPORATION; QNX SOFTWARE SYSTEMS CO.; QNX SOFTWARE SYSTEMS GMBH; QNX SOFTWARE SYSTEMS GMBH & CO. KG; QNX SOFTWARE SYSTEMS INTERNATIONAL CORPORATION; QNX SOFTWARE SYSTEMS, INC.; XS EMBEDDED GMBH (F/K/A HARMAN BECKER MEDIA DRIVE TECHNOLOGY GMBH)
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 022659/0743 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE 3RD ASSIGNOR. FILED ON 06/11/2002, RECORDED ON REEL 012981 FRAME 0276 ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST. Recorded Sep 4, 2002
From: COX, DAVID H.; WERNER, BERNARD M.; VOSSE, MARY
To: HARMAN INTERNATIONAL INDUSTRIES INCORPORATED
Reel/Frame 013262/0467 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2002
From: COX, DAVID H.; WERNER, BERNARD M.; VOSSE, MARRY
To: HARMAN INTERNATIONAL INDUSTRIES INCORPORATED
Reel/Frame 012981/0276 →