Positive photosensitive compositions
View Patent ↗A positive photosensitive composition comprising (A) a compound capable of generating a fluorine-substituted alkanesulfonic acid having 2 to 4 carbon atoms by irradiation of actinic rays or radiation, (B) a resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and being decomposed by the action of an acid to increase solubility in an alkali developer, (C) a basic compound, and (D) a fluorine and/or silicon surfactant.
1. A positive photosensitive composition comprising:
(A) a compound capable of generating a fluorine-substituted alkanesulfonic acid having 2 to 4 carbon atoms by irradiation of actinic rays or radiation,
(B) a resin having a monocyclic or polycyclic alicyclic hydrocarbon structure and being decomposed by the action of an acid to increase solubility in an alkali developer,
(C) a basic compound, and
(D) a fluorine and/or silicon surfactant.
2. The positive photosensitive composition according to claim 1 further comprising (E) a mixture of a hydroxyl-containing solvent and a hydroxyl-free solvent.
3. The positive photosensitive composition according to claim 2 , wherein the hydroxyl-containing solvent is selected from propylene glycol monomethyl ether and ethyl lactate.
4. The positive photosensitive composition according to claim 2 , wherein the hydroxyl-free solvent is selected from a solvent containing a ketone group or an ester group.
5. The positive photosensitive composition according to claim 2 , wherein the hydroxyl-free solvent is selected from propylene glycol monomethyl ether acetate, ethyl ethoxypropionate, 2-heptanone, γ-butyrolactone, cyclohexanone and butyl acetate.
6. The positive photosensitive composition according to claim 2 , wherein the mixture of a hydroxyl-containing solvent and a hydroxyl-free solvent is a mixture of propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate.
7. The positive photosensitive composition according to claim 1 , wherein the resin (B) has a structural unit represented by the following formula (I) or (II):
wherein R 1 to R 4 each independently represents a hydrogen atom, a carboxyl group, a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxycarbonyl group or a group having an acid decomposable group; and n stands for 0 or 1.
8. The positive photosensitive composition according to claim 1 , wherein the resin (B) has a (meth)acrylate structural unit.
9. The positive photosensitive composition according to claim 1 , wherein the basic compound (C) is a compound having a structure represented by the following formulas (A) to (E):
wherein, R 250 , R 251 and R 252 each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aminoalkyl group having 1 to 6 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms or a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, or R 250 and R 251 may be bonded to each other to form a ring;
wherein, R 253 , R 254 , R 255 and R 256 each independently represents an alkyl group having 1 to 6 carbon atoms.
10. The positive photosensitive composition according to claim 1 , wherein the basic compound (C) is a compound having a structure selected from an imidazole structure, a diazabicyclo structure, an onium hydroxide structure and an onium carboxylate structure.
11. The positive photosensitive composition according to claim 1 , wherein an onium of the onium hydroxide structure is selected from sulfonium, iodonium and ammonium.
12. The positive photosensitive composition according to claim 1 , wherein an onium of the onium carboxylate structure is selected from sulfonium, iodonium and ammonium.