Substrate terminal structure, liquid-crystal device and electronic apparatus
View Patent ↗A wiring substrate 7 is attached by pressure to a substrate overhang with an ACF 6 b, and substrate terminals 21 formed on the substrate overhang 2 c from ITO and the first terminals 21 formed on the rear surface of wiring substrate 7 are electrically connected. The wiring substrate 7 has second terminals 27 on its surface and these second terminals 27 are electrically connected to the first terminals located on the rear surface via a throughhole. The wiring pattern on the wiring substrate 7 is formed from a material with an electric resistance lower than that of the ITO forming the substrate terminals 21, which makes it possible to hold the resistance of the wiring on the substrate overhang 2 c to a low value.
1. A substrate terminal structure comprising:
a substrate;
substrate terminals formed on the substrate by a metal oxide film; and
a wiring substrate adhesively bonded to the substrate; wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminals; and
second terminals directly connected to said wiring pattern, said second terminals being electrically connected to an electrically conductive connecting element;
wherein the electrically conductive connecting element is one of a rubber connector and a spring connector; and
wherein the wiring pattern has an electric resistance lower than that of the metal oxide film.
2. The substrate terminal structure according to claim 1 , wherein the first and second terminals are formed from the same material as the wiring pattern.
3. The substrate terminal structure according to claim 1 , wherein the wiring pattern is formed from a material containing copper.
4. The substrate terminal structure according to claim 1 , wherein the wiring substrate further comprises a two-surface wiring substrate having a wiring pattern on both surfaces thereof, the first terminals are formed on one side of said two-surface wiring substrate, and the second terminals are formed on the opposite surface of said two-surface wiring substrate.
5. The substrate terminal structure according to claim 4 , wherein the second terminals are longer than the first terminals.
6. A liquid-crystal device comprising:
a pair of substrates sandwiching a liquid crystal;
substrate terminals formed from a metal oxide film on a substrate overhang which projects from at least one of said substrates outside of the other substrate; and
a wiring substrate adhesively bonded to the substrate overhang;
wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminals; and
second terminals directly connected to said wiring pattern, said second terminals being electrically connected to an electrically conductive connecting element;
wherein the electrically conductive connecting element is one of a rubber connector and a spring connector; and
wherein the wiring pattern has an electric resistance lower than that of the metal oxide film.
7. The liquid-crystal, device of claim 6 , wherein a width of the second terminals is wider than a width of the substrate terminalsoxide film.
8. A liquid-crystal device comprising:
a pair of substrates sandwiching liquid crystals;
an electronic component mounted on a substrate overhang which projects from at least one of said substrates outside of the other substrate;
substrate terminals provided on the substrate overhang connected to the terminals of the electronic component and formed by a metal oxide; and
a wiring substrate adhesively bonded to the substrate overhang;
wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminal; and
a second terminal directly connected to said wiring pattern, said second terminal being electrically connected to an electrically conductive connecting element;
wherein the electrically conductive connecting element is one of a rubber connector and a spring connector; and
wherein the wiring pattern has an electric resistance lower than that of the metal oxide film.
9. The liquid-crystal device according to claim 8 , wherein a width of the second terminals is wider than a width of the substrate terminals.
10. The liquid-crystal device according to claim 8 , wherein the electronic component further comprises an IC chip and the wiring substrate is provided on an input terminal side of said IC chip.
11. The liquid-crystal device according to claim 8 , wherein the first and second terminals are formed from the same material as the wiring pattern.
12. The liquid-crystal device according to claim 8 , wherein the wiring pattern is formed from a material containing copper.
13. The liquid-crystal device according to claim 8 , wherein the wiring substrate further comprises a two-surface wiring substrate having a wiring pattern on both surfaces thereof, the first terminals are formed on one side of said two-surface wiring substrate, and the second terminals are formed on the opposite surface of said two-surface wiring substrate.
14. The liquid-crystal device according to claim 13 , wherein the second terminals are longer than the first terminals.
15. An electronic apparatus comprising:
a liquid-crystal device;
a circuit substrate; and
an electrically conductive connecting element which electrically connects the liquid-crystal device to the circuit substrate;
wherein the liquid-crystal device includes:
a pair of substrates sandwiching liquid crystals;
substrate terminals formed from a metal oxide film on a substrate overhang which projects from at least one of said substrates outside of the other substrate; and
a wiring substrate adhesively bonded to the substrate overhang;
wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminals; and
second terminals directly connected to said wiring pattern;
wherein the wiring pattern has an electric resistance lower than that of the metal oxide film; and
wherein the electrically conductive connecting element electrically connects the second terminals located on the wiring substrate to the circuit substrate, and the electrically conductive connecting element is one of a rubber connector and a spring connector.
16. An electronic apparatus comprising:
a liquid-crystal device;
a circuit substrate; and
an electrically conductive connecting element which electrically connects the liquid-crystal device to the circuit substrate;
wherein the liquid-crystal device includes:
a pair of substrates sandwiching liquid crystals;
an electronic component mounted on a substrate overhang which projects from at least one of said substrates outside of the other substrate;
substrate terminals provided on the substrate overhang connected to the terminals of the electronic component and formed from a metal oxide; and
a wiring substrate adhesively bonded to the substrate overhang;
wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminals; and
second terminals directly connected to said wiring pattern;
wherein the wiring pattern has an electric resistance lower than that of the metal oxide film; and
wherein the electrically conductive connecting element electrically connects the second terminals located on the wiring substrate to the circuit substrate, and the electrically conductive connecting element is one of a rubber connector and a spring connector.
17. A liquid-crystal device comprising:
a pair of substrates sandwiching a liquid crystal;
substrate terminals formed from a metal oxide film on a substrate overhang which projects from at least one of said pair of substrates outside of the other of said pair of substrates; and
a wiring substrate entirely within and adhesively bonded to a boundary of the substrate overhang;
wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminals;
second terminals directly connected to said wiring pattern, said second terminals being electrically connected to an electrically conductive connecting element that is one of a rubber connector and a spring connector; and
wherein the wiring pattern has an electrical resistance lower that that of the metal oxide film.
18. A liquid crystal device comprising:
a pair of substrates sandwiching liquid crystals;
an electronic component mounted on a substrate overhang which projects from at least one of said pair of substrates outside of the other of said pair of substrates;
substrate terminals provided on the substrate overhang connected to terminals of the electronic component and formed by a metal oxide; and
a wiring substrate adhesively bonded within a boundary of the substrate overhang;
wherein the wiring substrate includes:
first terminals connected to the substrate terminals;
a continuous wiring pattern directly extending from said first terminals;
a second terminal directly connected to said wiring pattern, said second terminals being electrically connected to an electrically conductive connecting element that is one of a rubber connector and a spring connector; and
wherein the wiring pattern has an electric resistance lower than that of the metal oxide film.