Optoelectronic module with thermally isolated components
View Patent ↗A temperature-controlled optoelectronic module that includes a module housing, a laser mount structure for affixing a laser package in the module housing, an optical fiber receptacle structure disposed adjacent to the laser mount structure, a thermal isolator affixed between the laser mount structure and the optical fiber receptacle structure, and a temperature controller coupled to the laser mount structure and operable to regulate temperature of the laser package is disclosed. In the absence of the thermal isolator, a “thermal short” may be created between the module housing and the laser package, substantially reducing the efficiency of the temperature controller. The presence of the thermal isolator eliminates the “thermal short,” substantially increases the effectiveness of the temperature controller and enables the miniaturization of temperature-controlled optoelectronic transceiver modules.
1. An apparatus, comprising:
a housing;
a first structure disposed in the housing, the first structure configured to affix an optically active component within the housing;
a second structure disposed adjacent to the first structure in the housing and configured to receive an optical fiber;
a thermal isolator disposed within the housing between the first structure and the second structure to separate at least a portion of the second structure from the first structure and to substantially reduce heat conduction between the first structure and the second structure; and
a temperature controller coupled to the first structure and operable to regulate temperature of the optically active component without regulating temperature of the second structure;
further comprising:
a fastener that affixes the first structure, the thermal isolator and the second structure; and
a ceramic washer configured to provide thermal isolation between the fastener and the first structure.
2. The apparatus of claim 1 , wherein the temperature controller comprises a thermal-electric cooler.
3. The apparatus of claim 1 , wherein the thermal isolator comprises a piece of ceramic having low thermal conductivity.
4. The apparatus of claim 1 , wherein the second structure comprises spacing elements configured to reduce conduction of heat between the second structure and the housing.
5. The apparatus of claim 1 , further comprising a thermistor coupled to the first structure and operable to provide a close estimation of a temperature of the optically active component.
6. The apparatus of claim 1 , wherein the optically active component comprises a laser emitter.
7. An apparatus, comprising:
a housing;
a laser mount structure disposed in the housing;
a laser package disposed in the laser mount structure, the laser packaging having a laser emitter;
a thermistor disposed proximally to the laser package operable to provide an estimation of a temperature of the laser emitter;
an optical fiber receptacle structure disposed adjacent to the laser mount structure and configured to receive an optical fiber;
a thermal isolator disposed within the housing and affixed between the laser mount structure and the optical fiber receptacle structure to separate at least a portion of the optical fiber receptacle structure from the laser mount structure and to substantially reduce conduction of heat between the laser mount structure and the optical fiber receptacle structure; and
a thermal-electric cooler coupled to the laser mount structure and operable to regulate temperature of the laser without regulating temperature of the optical fiber receptacle structure;
comprising:
a screw that affixes the laser mount structure, the thermal isolator and the optical fiber receptacle structure; and
a ceramic washer configured to provide thermal isolation between the screw and the laser mount structure.
8. The apparatus of claim 7 , wherein the thermal isolator comprises a piece of ceramic having low thermal conductivity.
9. The apparatus of claim 7 , wherein the optical fiber receptacle structure comprises spacing elements configured to reduce conduction of heat between the optical fiber receptacle structure and the housing.
10. A transmitter optical sub-assembly comprises:
a laser mount structure;
a laser package disposed in the laser mount structure, the laser package having a laser emitter disposed therein;
an optical fiber receptacle structure coupled to the laser mount structure and configured to receive an optical fiber;
a thermal isolator disposed between the laser mount structure and the optical fiber receptacle structure to separate at least a portion of the optical fiber receptacle structure from the laser mount structure and to substantially reduce conduction of heat between the laser mount structure and the optical fiber receptacle structure;
a fastener that affixes the laser mount structure, the thermal insulator and the optical fiber receptacle structure; and
a ceramic washer configured to provide thermal insulation between the fastener and the laser mount structure.
11. The transmitter optical subassembly of claim 10 further comprising a temperature controller coupled to the laser mount structure and operable to regulate temperature of the laser emitter without regulating temperature of the optical fiber receptacle structure.
12. The transmitter optical subassembly of claim 11 , wherein the temperature controller comprises a thermal-electric cooler.
13. The transmitter optical subassembly of claim 10 , wherein the thermal insulator comprises a piece of ceramic having low thermal conductivity.
14. The transmitter optical subassembly of claim 10 , further comprising a thermistor coupled to the laser mount structure and operable to detect a close estimation of a temperature of the laser emitter.