Split source RF MOSFET device
View Patent ↗An RF MOS transistor having improved AC output conductance and AC output capacitance includes parallel interdigitated source and drain regions separated by channel regions and overlying gates. Grounded tap regions contacting an underlying well are placed contiguous to source regions and reduce distributed backgate resistance, lower backgate channel modulation, and lower output conductance.
1. An RF MOS transistor in a semiconductor substrate, said RF MOS transistor comprising:
a plurality of first source/drain regions elongated in a first direction and formed in said semiconductor substrate;
a plurality of second source/drain regions elongated in the first direction and formed in said semiconductor substrate, said elongated first source/drain regions displaced along
a second direction from, parallel to, and interdigitated with said elongated second source/drain regions, the first direction orthogonal to the second direction;
a plurality of gate electrodes elongated in the first direction and over said semiconductor substrate defining channel regions separating said elongated first source/drain regions from said elongated second source/drain regions; and
a plurality of tap regions elongated in the first direction and formed in said semiconductor substrate displaced along the second direction from, parallel to, and interdigitated with said elongated first and second source/drain regions, said elongated tap regions providing an electrical voltage reference for said channel regions and arranged so that each elongated second source/drain region is contiguous along the first direction to an elongated tap region.
2. The RF MOS transistor of claim 1 wherein for a majority of said elongated tap regions, a pair of said elongated second source/drain regions are disposed on either side of an elongated tap region.
3. The RF MOS transistor of claim 2 further comprising a tap region enclosing elongated first and second source/drain regions, said elongated gate electrodes and said elongated tap regions.
4. The RF MOS transistor of claim 2 wherein said elongated tap regions, and said first and second source/drain regions comprise elongated rectangular regions on a surface of said semiconductor substrate.
5. The RF MOS transistor of claim 3 wherein said enclosing tap region comprises a rectangle on said surface of said semiconductor substrate.
6. The RF MOS transistor of claim 1 wherein said first and second source/drain regions comprise N-doped semiconductor regions.
7. The RF MOS transistor of claim 3 wherein said elongated tap regions and said enclosing tap region comprise P-doped semiconductor regions.
8. The RF MOS transistor of claim 7 wherein said elongated tap regions said enclosing tap region and said channel regions comprise a P-doped semiconductor region enclosing said first and second source/drain regions.
9. An integrated circuit in a semiconductor substrate, comprising:
a circuit block having input/output terminals having an AC signal at an RF frequency; and
at least one RF MOS transistor comprising:
a plurality of drain regions elongated in a first direction and formed in said semiconductor substrate, each drain region parallel to each other and connected to each other in parallel by a drain terminal, said drain terminal coupled to a first power supply;
a plurality of source regions elongated in the first direction and formed in said semiconductor substrate, said source regions displaced along a second direction from, parallel to, and interdigitated with said drain regions, the first direction orthogonal to the second direction, said source regions connected to each other in parallel by a source terminal, said source terminal coupled to a second power supply;
a plurality of gate electrodes elongated in the first direction and over said semiconductor substrate defining channel regions separating said elongated drain regions from said elongated source regions, said elongated gate electrodes connected to each other in parallel to a gate terminal, said gate terminal connected to said circuit block output terminal; and
a plurality of tap regions elongated in the first direction and formed in said semiconductor substrate, said tap regions being parallel to and interdigitated with said elongated drain and source regions, said elongated tap regions providing an electrical voltage reference for said channel regions and arranged so that each elongated source region is contiguous along the first direction to an elongated tap region so that backgate modulation of said channel regions is reduced.
10. The integrated circuit of claim 9 wherein said RF frequency is at least 2 GHz.
11. The integrated circuit of claim 10 wherein said drain terminal is coupled to said first power supply through a first inductor and said source terminal is coupled to said second power supply through a second inductor.
12. The integrated circuit of claim 9 wherein for a majority of said elongated tap regions, a pair of said elongated source regions are disposed on either side of an elongated tap region.
13. The integrated circuit of claim 12 further comprising a tap region enclosing said elongated source and drain regions, said elongated gate electrodes and said elongated tap regions.
14. The integrated circuit of claim 12 wherein said elongated tap region and source source and drain regions comprise elongated rectangular regions on a surface of said semiconductor substrate.
15. The integrated circuit of claim 13 wherein said enclosing tap region comprises a rectangle on said surface of said semiconductor substrate.
16. The integrated circuit of claim 9 wherein said source and drain regions comprise N-doped semiconductor regions.
17. The integrated circuit of claim 13 wherein said elongated tap regions and said enclosing tap region comprise P-doped semiconductor regions.
18. The integrated circuit of claim 17 wherein said elongated tap regions said enclosing tap region and said channel regions comprise a P-doped semiconductor region enclosing said source and drain regions.