IP Library Granted Patent US 7,064,278
Granted Patent B2
US 7,064,278 · App. 10/106,977 · Granted Jun 20, 2006

Impedance matching connection scheme for high frequency circuits

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Quick Facts
Patent No.
US 7,064,278
App. No.
10/106,977
Granted
Jun 20, 2006
Kind
B2
Abstract

Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided. Connecting elements having length, width, and thickness, are provided for terminals of a component to be connected to a trace. The connecting element is electrically coupled between the terminal and the trace, typically by soldering. The dimensions of the connecting element are chosen to reduce or eliminate the impedance mismatch which would result from a direct connection between the trace and component. Connecting elements are generally L-shaped, i.e., having first and second planar portions perpendicular with respect to each other, and having a curving portion that connects the first and second planar portions. In one embodiment, dimensions of at least a portion of the connecting element are such that its width increases as its distance from a ground plane within the substrate increases.

Claims (22)

1. An electrical apparatus, comprising:

an electrically insulating substrate;

a first trace and a second trace, each disposed on a surface of the substrate, the first trace and the second trace being spaced apart from one another;

a first conductive region disposed within the substrate such that the first conductive region underlies at least a portion of the first trace and at least a portion of the second trace;

an electrical component overlying the substrate, disposed between the first trace and the second trace, the electrical component including a first connection region and a second connection region; and

a first connecting element electrically coupled between the first trace and the first connection region of the electrical component;

wherein each of the first trace, the first connecting element, and the second trace, has a resistance per unit length; and the resistance per unit length of at least a portion of the first connecting element is greater than the resistance per unit length of at least a portion of the first trace, said portion of the first connecting element lying within the electrical path between the first trace and the first connection region of the electrical component;

wherein the first connecting element comprises a continuous piece of electrically conductive material that has a first substantially planar portion, an upwardly extending curving portion, and a second substantially planar portion; wherein the first substantially planar portion and the second substantially planar portion are substantially perpendicular to each other, and the upwardly extending curving portion has a radius of curvature;

wherein the upwardly extending curving portion of the first connecting element has a width which varies across its length approximately in proportion to the distance between the first conductive regions and the first connecting element.

2. The electrical apparatus of claim 1 , further comprising an adhesive disposed between the substrate and the electrical component; and solder disposed in at least a portion of a region defined by an overlap of the first trace and the first connecting element.

3. The electrical apparatus of claim 1 , further comprising a first amount of solder disposed in at least a portion of a region defined by an overlap of the first trace and the first connecting element; and a second amount of solder disposed in at least a portion of a region defined by an overlap of the first connecting element and the first connection region.

4. An electrical apparatus, comprising:

an electrically insulating substrate;

a first trace and a second trace, each disposed on a surface of the substrate, the first trace and the second trace being spaced apart from one another;

a first conductive region disposed within the substrate such that the first conductive region underlies at least a portion of the first trace and at least a portion of the second trace;

an electrical component overlying the substrate, disposed between the first trace and the second trace, the electrical component including a first connection region and a second connection region; and

a first connecting element electrically coupled between the first trace and the first connection region of the electrical component;

wherein each of the first trace, the first connecting element, and the second trace, has a resistance per unit length; and the resistance per unit length of at least a portion of the first connecting element is greater than the resistance per unit length of at least a portion of the first trace, said portion of the first connecting element lying within the electrical path between the first trace and the first connection region of the electrical component;

wherein the first connecting element comprises a continuous piece of electrically conductive material that has a first substantially planar portion, an upwardly extending curving portion, and a second substantially planar portion; wherein the first substantially planar portion and the second substantially planar portion are substantially perpendicular to each other, and the upwardly extending curving portion has a radius of curvature;

wherein the upwardly extending curving portion of the first connecting element has a width which varies across its length such that a capacitance between the first connecting element and the first conductive region remains substantially constant across the length of the upwardly extending curving portion.

5. The electrical apparatus of claim 4 , wherein the capacitance is approximately equal to the capacitance between the first trace and the first conductive region.

6. The electrical apparatus of claim 4 , wherein the upwardly extending curving portion of the first connecting element has a thickness which becomes thinner as its width becomes wider.

Assignments (4)
MERGER Recorded Nov 6, 2015
From: NULL NETWORKS LLC
To: XYLON LLC
Reel/Frame 037057/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2006
From: TRIQUINT SEMICONDUCTOR, INC.
To: NULL NETWORKS LLC
Reel/Frame 017706/0550 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2005
From: TRIQUINT SEMICONDUCTOR, INC.
To: NULL NETWORKS LLC
Reel/Frame 017136/0951 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2005
From: NETWORK ELEMENTS, INC.
To: TRIQUINT SEMICONDUCTOR, INC.
Reel/Frame 016182/0609 →