IP Library Patent Application 10108840
Patent Application Utility
App. No. 10/108,840 · Confirmation No. 3583

Highly conductive molding compounds for use as fuel cell plates and the resulting products

Inventor: Kurt I. Butler
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2004-09-21 ABN Abandonment 2 View
2004-03-15 CTNF Non-Final Rejection 13 View
2004-03-15 1449 List of References cited by applicant and considered by examiner 3 View
2004-03-15 892 List of references cited by examiner 1 View
2004-03-15 FWCLM Index of Claims 1 View
2004-03-15 SRFW Search information including classification, databases and other search related notes 1 View
2004-03-08 SRNT Examiner's search strategy and results 2 View
2004-01-15 LET. Miscellaneous Incoming Letter 2 View
2003-04-03 C.AD Change of Address 1 View
2002-05-13 IDS Information Disclosure Statement (IDS) Form (SB08) 8 View
2002-05-13 FOR Foreign Reference 1 View
2002-05-13 FOR Foreign Reference 1 View
2002-05-13 FOR Foreign Reference 10 View
2002-05-13 FOR Foreign Reference 34 View
2002-03-27 TRNA Transmittal of New Application 4 View
2002-03-27 SPEC Specification 61 View
2002-03-27 CLM Claims 7 View
2002-03-27 ABST Abstract 1 View
2002-03-27 DRW Drawings-only black and white line drawings 5 View
2002-03-27 OATH Oath or Declaration filed 2 View
2002-03-27 WFEE Fee Worksheet (SB06) 1 View
2002-03-27 WFEE Fee Worksheet (SB06) 1 View
2002-03-27 WCLM Claims Worksheet (PTO-2022) 1 View
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Quick Facts
App. No.
10/108,840
Filed
2002-03-27
Pub. No.
US20030042468A1
Art Unit
1751