Fabricating method of an array substrate having polysilicon thin film transistor
View Patent ↗A fabricating method of an array substrate includes: forming a semiconductor layer of polysilicon on a substrate, the semiconductor layer having first and second regions; forming a gate insulating layer on the semiconductor layer; forming a gate electrode on the gate insulating layer on the first region of the semiconductor layer; forming source and drain regions by doping impurities into the second region of the semiconductor layer; forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, the first and second contact holes being formed by consecutive dry and wet etching methods; forming source and drain electrodes on the interlayer insulating layer, the source and drain electrodes contacting the source and drain regions through the first and second contact holes, respectively; forming a passivation layer on the source and drain electrodes, the passivation layer having a third contact hole exposing the drain electrode; and forming a pixel electrode on the passivation layer, the pixel electrode contacting the drain electrode through the third contact hole.
1. A fabricating method of an array substrate, comprising:
forming a semiconductor layer of polysilicon on a substrate, the semiconductor layer having first and second regions;
forming a gate insulating layer on the semiconductor layer;
forming a gate electrode on the gate insulating layer on the first region of the semiconductor layer;
forming source and drain regions by doping impurities into the second region of the semiconductor layer;
forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, wherein forming the first and second contact holes further includes,
forming a photo-resist on the interlayer insulating layer, the photo-resist having a pattern of the first and second contact holes;
dry-etching the interlayer insulating layer before the photo-resist pattern hardens;
then, wet-etching the interlayer insulating layer so as to expose the second region of the semiconductor layer;
removing the photo-resist pattern;
forming source and drain electrodes on the interlayer insulating layer, the source and drain electrodes contacting the source and drain regions through the first and second contact holes, respectively;
forming a passivation layer on the source and drain electrodes, the passivation layer having a third contact hole exposing the drain electrode; and
forming a pixel electrode on the passivation layer, the pixel electrode contacting the drain electrode through the third contact hole.
2. The method according to claim 1 , wherein forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, the first and second contact holes being formed by subsequent dry and wet etching methods.
3. The method according to claim 1 , wherein forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, the first and second contact holes being formed by consecutive dry and wet etching methods.
4. The method according to claim 1 , wherein forming the interlayer insulating layer comprises:
forming a photo resist pattern on the interlayer insulating layer;
dry etching the interlayer insulating layer partially using the photo resist pattern as a mask; and
wet etching the interlayer insulating layer fully, thereby forming the first and second contact holes exposing the source and drain electrodes, respectively.
5. The method according to claim 4 , wherein forming the passivation layer comprises the same steps as forming the interlayer insulating layer.
6. The method according to claim 1 , further comprising forming a buffer layer under the semiconductor layer.
7. The method according to claim 1 , wherein the semiconductor layer is formed by crystallization of amorphous silicon.
8. The method according to claim 1 , wherein the interlayer insulating layer and the passivation layer includes an inorganic insulating material.
9. The method according to claim 8 , wherein the inorganic insulating material is one of silicon oxide (SiO 2 ), silicon nitride (SiNx), tetraethoxysilane (TEOS) and aluminum oxide (Al 2 O 3 ).
10. The method according to claim 1 , wherein the gate electrode includes a conductive metallic material.
11. The method according to claim 10 , wherein the conductive metallic material is one of aluminum (Al), chromium (Cr), tungsten (W), molybdenum (Mo), antimony (Sb), tantalum (Ta) and aluminum alloy.
12. The method according to claim 1 , wherein the source and drain electrodes include a conductive metallic material.
13. The method according to claim 12 , wherein the conductive material is one of aluminum (Al), chromium (Cr), tungsten (W), molybdenum (Mo), antimony (Sb), tantalum (Ta) and aluminum alloy.
14. The method according to claim 1 , wherein the third contact hole is formed by dry and wet etching methods and exposes the drain electrode.
15. A fabricating method of a thin film transistor, comprising:
forming a semiconductor layer of polysilicon on a substrate, the semiconductor layer having first and second regions;
forming a gate insulating layer on the semiconductor layer;
forming a gate electrode on the gate insulating layer on the first region of the semiconductor layer;
forming source and drain regions by doping impurities into the second region of the semiconductor layer;
forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, wherein forming the first and second contact holes further includes,
forming a photo-resist on the interlayer insulating layer, the photo-resist having a pattern of the first and second contact holes;
dry-etching the interlayer insulating layer before the photo-resist pattern hardens;
then, wet-etching the interlayer insulating layer so as to expose the second region of the semiconductor layer;
removing the photo-resist pattern; and
forming source and drain electrodes on the interlayer insulating layer, the source and drain electrodes contacting the source and drain regions through the first and second contact holes, respectively.
16. The method according to claim 15 , wherein forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, the first and second contact holes being formed by subsequent dry and wet etching methods.
17. The method according to claim 15 , wherein forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, the first and second contact holes being formed by consecutive dry and wet etching methods.
18. The method according to claim 15 , wherein forming the interlayer insulating layer comprises:
forming a photo resist pattern on the interlayer insulating layer;
dry etching the interlayer insulating layer partially using the photo resist pattern as a mask; and
wet etching the interlayer insulating layer fully, thereby forming the first and second contact holes exposing the source and drain electrodes, respectively.
19. The method according to claim 15 , wherein the semiconductor layer is formed by crystallization of amorphous silicon.
20. The method according to claim 15 , wherein the interlayer insulating layer and the passivation layer include an inorganic insulating material.
21. The method according to claim 20 , wherein the inorganic insulating material is one of silicon oxide (SiO 2 ), silicon nitride (SiNx), tetraethoxysilane (TEOS) and aluminum oxide (Al 2 O 3 ).
22. The method according to claim 15 , wherein the gate electrode includes a conductive metallic material.
23. The method according to claim 22 , wherein the conductive metallic material is one of aluminum (Al), chromium (Cr), tungsten (W), molybdenum (Mo), antimony (Sb), tantalum (Ta) and aluminum alloy.
24. The method according to claim 15 , wherein the source and drain electrodes include a conductive metallic material.
25. The method according to claim 24 , wherein the conductive metallic material is one of aluminum (Al), chromium (Cr), tungsten (W), molybdenum (Mo), antimony (Sb), tantalum (Ta) and aluminum alloy.
26. A fabricating method of an array substrate, comprising:
forming a semiconductor layer of polysilicon on a substrate, the semiconductor layer having first and second regions;
forming a gate insulating layer on the semiconductor layer;
forming a gate electrode on the gate insulating layer on the first region of the semiconductor layer;
forming source and drain regions by doping impurities into the second region of the semiconductor layer; and
forming an interlayer insulating layer on the gate electrode and the source and drain regions, the interlayer insulating layer having first and second contact holes exposing the source and drain regions, respectively, wherein forming the first and second contact holes further includes,
forming a photo-resist on the interlayer insulating layer, the photo-resist having a pattern of the first and second contact holes;
dry-etching the interlayer insulating layer before the photo-resist pattern hardens;
then, wet-etching the interlayer insulating layer so as to expose the second region of the semiconductor layer;
removing the photo-resist pattern.
27. The method according to claim 26 , wherein forming the interlayer insulating layer comprises:
forming a photo resist pattern on the interlayer insulating layer;
dry etching the interlayer insulating layer partially using the photo resist pattern as a mask; and wet etching the interlayer insulating layer fully, thereby forming the first and second contact holes exposing the source and drain electrodes, respectively.
28. The method according to claim 26 , wherein the semiconductor layer is formed by crystallization of amorphous silicon.
29. The method according to claim 26 , wherein the interlayer insulating layer and the passivation layer include inorganic insulating material, the interlayer insulating layer including one of silicon oxide (SiO 2 ), silicon nitride (SiNx), tetraethoxysilane (TEOS) and aluminum oxide (Al 2 O 3 ).
30. The method according to claim 26 , wherein the gate electrode includes conductive metallic material, the conductive metallic material including one of aluminum (Al), chromium (Cr), tungsten (W), molybdenum (Mo), antimony (Sb), tantalum (Ta) and aluminum alloy.
31. The method according to claim 26 , wherein the source and drain electrodes include conductive metallic material, the conductive metallic material including one of aluminum (Al), chromium (Cr), tungsten (W), molybdenum (Mo), antimony (Sb), tantalum (Ta) and aluminum alloy.