Method and apparatus for measuring the geometrical structure of an optical component in transmission
View Patent ↗A method for measuring the geometrical structure of an optical component ( 2 ) in transmission, comprises illuminating the optical component by means of a first incident beam ( 8, 10 ), the wavefront of which is known. After the first beam is transmitted by the optical component, its wavefront is measured by deflectometry ( 16, 18 ). The optical component is then illuminated by a second incident beam ( 12, 14 ), the wavefront of which is known. After the second beam is transmitted by the optical component, its wavefront is measured by deflectometry ( 16, 18 ). The geometrical structure of the optical component is then calculated from the measured wavefronts. Measuring light transmitted in two distinct optical configurations allows a calculation by optimizing the two surfaces of the component, without prior knowledge of one of the surfaces. The first and second beams may be different and may illuminate the same surface of the component; thus it is possible to use identical beams and to illuminate each surface of the component in succession.
1. A method for measuring the geometrical structure of an optical component in transmission, comprising the steps:
of illuminating the optical component by means of a first incident beam, the wavefront of which is known,
of measuring the wavefront of said first beam after transmission by said optical component,
of illuminating the optical component by a second incident beam, the wavefront of which is known,
of measuring the wavefront of said second beam after transmission by said optical component, and
of calculating the geometrical structure of said optical component from the wavefronts measured during said measurement steps,
wherein, at the various measurement steps, the wavefronts on the side facing the same surface of the component are different.
2. The method of claim 1 , wherein the measurement step is carried out by Hartmann or Shack-Hartmann deflectometry.
3. The method of claim 1 , wherein the measurement step is carried out by fringe deflectometry.
4. The method of claim 1 , wherein the measurement step is a step of measuring by interferometry.
5. The method of claim 1 , wherein the illumination steps comprise illuminating the component on one of its surfaces, and illuminating the component on the other of its surfaces.
6. The method of claim 5 , wherein the first and second beams have identical known wavefronts.
7. The method of claim 6 , wherein the illumination steps comprise illuminating the optical component by the same incident beam, and wherein the method further comprises a step of turning the optical component around.
8. The method of claim 1 , wherein the illumination steps comprise illuminating the component on only one of its surfaces.
9. The method of claim 8 , wherein in that the first and second beams have different known wavefronts.
10. The method of claim 1 , wherein the calculation step is carried out by optimizing a merit function calculated from at least two measurement steps.
11. The method of claim 1 , further comprising a step of measuring the thickness of the component at at least one point.
12. The method of claim 1 , further comprising the steps of:
illuminating the optical component by a third incident beam, the wavefront of which is known,
measuring the wavefront of said third beam after transmission by said optical component.
13. An apparatus for measuring the geometrical structure of an optical component in transmission, comprising:
a first source for illuminating the optical component with a first incident beam, the wavefront of which is known,
a second source for illuminating the optical component with a second incident beam, the wavefront of which is known, and different from the wavefront of said first beam;
a wavefront measuring device for measuring the wavefront of said first beam after transmission by said optical component and for measuring the wavefront of said second beam after transmission by said optical component,
a computing logic for calculating the geometrical structure of said optical component from the measured wavefronts of said first and second beams.
14. The apparatus of claim 13 , wherein the wavefront measuring device comprises a microlens matrix.
15. The apparatus of claim 13 , wherein the wavefront measuring device comprises an array.
16. The apparatus of claim 13 , wherein the first source and the second source illuminate the component respectively on each of its surfaces.
17. The apparatus of claim 13 , wherein the first source and the second source illuminate the same surface of the component.
18. The apparatus of claim 13 , further comprising a thickness measuring device for measuring the thickness of the component.
19. The apparatus of claim 13 , further comprising a third source for illuminating the optical component with a third incident beam, the wavefront of which is known, wherein the wavefront measuring device is further adapted for measuring the wavefront of said third beam after transmission by said optical component.
20. The apparatus of claim 13 , further having a light source adapted for displaying microetching on the component.
21. An apparatus for measuring the geometrical structure of an optical component in transmission, comprising:
a first source for illuminating the optical component of one of its surfaces with a first incident beam, the wavefront of which is known,
a second source for illuminating the optical component on another of its surfaces with a second incident beam, the wavefront of which is known;
a wavefront measuring device for measuring the wavefront of said first beam after transmission by said optical component and for measuring the wavefront of said second beam after transmission by said optical component,
a computing logic for calculating the geometrical structure of said optical component from the measured wavefronts of said first and second beams.
22. The apparatus of claim 21 , wherein the wavefront measuring device comprises a microlens matrix.
23. The apparatus of claim 21 , wherein the wavefront measuring device comprises an array.
24. The apparatus of claim 21 , wherein the first and second beams have identical wavefronts.
25. The apparatus of claim 21 , wherein the first and second beams have different wavefronts.
26. The apparatus of claim 21 , further comprising a thickness measuring device for measuring the thickness of the component.
27. The apparatus of claim 21 , further comprising a third source for illuminating the optical component with a third incident beam, the wavefront of which is known, wherein the wavefront measuring device is further adapted for measuring the wavefront of said third beam after transmission by said optical component.
28. The apparatus of claim 21 , further having a light source adapted for displaying microetching on the component.