IP Library Granted Patent US 6,937,113
Granted Patent B2
US 6,937,113 · App. 10/114,326 · Granted Aug 30, 2005

Branching filter package

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,937,113
App. No.
10/114,326
Granted
Aug 30, 2005
Kind
B2
Abstract

A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.

Claims (47)

1. A surface acoustic wave (SAW) duplexer comprising:

a transmitting SAW filter having a plurality of first serial arm SAW resonators and a plurality of first parallel arm SAW resonators;

a receiving SAW filter having a plurality of second serial arm SAW resonators and a plurality of second parallel arm SAW resonators, wherein a number of the second parallel arm SAW resonators is larger than a number of the first parallel arm SAW resonators;

a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed;

a package base board on which the single piezoelectric substrate is mounted; and

an antenna terminal formed on the package base board, wherein the antenna terminal is connected to the transmitting and receiving SAW filters.

2. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

a connecting portion formed on the package base board, wherein the connecting portion is connected to the transmitting and receiving SAW filters; and

an impedance matching circuit connected between the antenna terminal and the connecting portion.

3. A surface acoustic wave duplexer as claimed in claim 2 , wherein the impedance matching circuit has a strip line circuit and an open circuit.

4. A surface acoustic wave duplexer as claimed in claim 3 , wherein the strip line circuit has an inductance element and the open circuit has a capacitance element.

5. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

a branching circuit connected between the antenna terminal and the receiving SAW filter.

6. A surface acoustic wave duplexer as claimed in claim 5 , wherein the branching circuit is formed by a wiring pattern.

7. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

a branching circuit connected between the antenna terminal and the transmitting SAW filter.

8. A surface acoustic wave duplexer as claimed in claim 7 , wherein the branching circuit is formed by a wiring pattern.

9. A surface acoustic wave duplexer as claimed in claim 3 , wherein the package base board has first and second package base boards, and wherein the strip line circuit is formed on the first package base board and the open circuit is formed on the second package.

10. A surface acoustic wave duplexer as claimed in claim 9 , wherein the package base board further has a third package base board, the third package base board being disposed between the first package base board and the second package base board, and wherein the single piezoelectric substrate is mounted on the third package base board.

11. A surface acoustic wave duplexer as claimed in claim 10 , further comprising:

two ground voltage patterns for the transmitting and receiving SAW filters formed separately on the third package base board.

12. A surface acoustic wave duplexer as claimed in claim 1 , wherein the surface acoustic wave duplexer has a characteristic impedance higher than approximately 40 ohms and lower than approximately 50 ohms.

13. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

a plurality of the package base boards constituting the package base board; and

two ground voltage patterns for the transmitting and receiving SAW filters formed separately on one of the plurality of the package base boards.

14. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

a heat radiating opening which radiates a heat generated from the transmitting and receiving SAW filters out of the surface acoustic wave duplexer.

15. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

a plurality of the package base boards constituting the package base board; and

a spurious eliminating open stub formed on one of the plurality of the package base boards.

16. A surface acoustic wave duplexer as claimed in claim 1 , further comprising:

transmitting and receiving terminals formed on the package base board;

a transmitting input matching circuit connected between the transmitting terminal and the transmitting SAW filter; and

a receiving output matching circuit connected between the receiving terminal and the receiving SAW filter.

17. A surface acoustic wave duplexer as claimed in claim 16 , wherein the transmitting input matching circuit and the receiving output matching circuit are formed on the package base board.

18. A surface acoustic wave (SAW) duplexer comprising:

a transmitting SAW filter having a first input portion, a first output portion and a plurality of first SAW resonators, wherein the first SAW resonators are coupled between the first input portion of the first output portion and a ground potential;

a receiving SAW filter having a second input portion, a second output portion and a plurality of second SAW resonators, wherein the second SAW resonators are coupled between the second input portion or the second output portion and the ground potential and wherein a number of the second SAW resonators is larger than a number of the first SAW resonators;

a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed;

a package base board on which the single piezoelectric substrate is mounted; and

an antenna terminal formed on the package base board, wherein the antenna terminal is connected to the transmitting and receiving SAW filters.

19. A surface acoustic wave duplexer as claimed in claim 18 , further comprising:

a branching circuit connected between the antenna terminal and the receiving SAW filter.

20. A surface acoustic wave duplexer as claimed in claim 19 , wherein the branching circuit is formed by a wiring pattern.

21. A surface acoustic wave duplexer as claimed in claim 18 , further comprising:

a branching circuit connected between the antenna terminal and the transmitting SAW filter.

22. A surface acoustic wave duplexer as claimed in claim 21 , wherein the branching circuit is formed by a wiring pattern.

Assignments (6)
MERGER Recorded Jan 25, 2016
From: INTELLECTUAL VENTURES FUND 77 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037577/0581 →
CONFIRMATORY ASSIGNMENT Recorded May 8, 2012
From: OHASHI, WATARU; SHIMAMURA, HAJIME; KOMAZAKI, TOMOKAZU; FUJITA, YOSHIAKI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 028177/0549 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2012
From: LAPIS SEMICONDUCTOR CO., LTD.
To: INTELLECTUAL VENTURES FUND 77 LLC
Reel/Frame 028093/0534 →
CHANGE OF NAME Recorded Jan 31, 2012
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027622/0360 →
CHANGE OF NAME Recorded Mar 5, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022399/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2002
From: OHASHI, WATARU; SHIMAMURA, HAJIME; KOMAZAKI, TOMOKAZU; FUJITA, YOSHIAKI
To: OKI ELECTRIC INDUSTRY CO. LTD.
Reel/Frame 013129/0257 →