IP Library Granted Patent US 6,685,543
Granted Patent Utility
US 6,685,543 · Confirmation No. 3153

COMPENSATING CHEMICAL MECHANICAL WAFER POLISHING APPARATUS AND METHOD

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Code Description Pages PDF
2003-12-09 LET. Miscellaneous Incoming Letter 1 View
2003-12-09 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-04-08 TRNA Transmittal of New Application 3 View
2002-04-08 A.PE Preliminary Amendment 2 View
2002-04-08 SPEC Specification 12 View
2002-04-08 CLM Claims 4 View
2002-04-08 ABST Abstract 1 View
2002-04-08 DRW Drawings-only black and white line drawings 10 View
2002-04-08 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,685,543
App. No.
10/117,088
Filed
2002-04-08
Granted
2004-02-03
Pub. No.
US20030100196A1
Art Unit
3723
PTA
0 days