Electrically conductive silicones and method of manufacture thereof
View Patent ↗An electrically conductive silicone composition comprising an electrically conductive filler; organopolysiloxane mixture comprising a catalyst which promotes the addition of Si-bonded hydrogen onto alkenyl multiple bonds; an organopolysiloxane having at least two alkenyl groups per molecule; an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; optionally, a fluid organopolysiloxane having a viscosity less than about 1000 centipoise; and optionally, an organopolysiloxane gel formulation, the composition, when cured, having a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTMD-2240 and an electrical resistivity of less than or equal to about 10 −6 ohm-cm.
1. An electrically conductive, cured silicone formed from a curable, castable composition comprising
an electrically conductive filler; and
an organopolysiloxane mixture having a viscosity of less than about 100,000 cps, the mixture comprising
a catalyst that promotes cure of the curable composition,
an organopolysiloxane having at least two alkenyl groups per molecule,
an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and
an organopolysiloxane gel formulation; wherein the cured silicone has a Shore A Durometer hardness of less than or equal to about 60 measured according to ASTM D-2240, a compression set resistance of less than about 35% measured according to ASTM D-395-Method B at 100° C. under 25% compression for 70 hours, and a volume resistivity of less than about 10 6 ohm-cm.
2. The cured silicone of claim 1 , wherein the electrically conductive filler is a particulate comprising a metal or a metal alloy.
3. The cured silicone of claim 2 , having a Shore A Durometer hardness of less than about 50, a compression set resistance of less than or equal to about 30% measured at 100° C. under 25% compression for 70 hours, and a volume resistivity less than or equal to about 10 2 ohm-cm, and greater than or equal to about 10 −4 ohm-cm when cured.
4. The cured silicone of claim 1 , wherein the particulate metal or metal alloy is selected from the group consisting of gold, silver, nickel, copper, and alloys comprising at least one of the foregoing metals.
5. The cured silicone of claim 2 , wherein the electrically conductive filler is a mixture comprising nickel coated graphite having an average longest dimension of about 45 micrometers and nickel-coated graphite having an average longest dimension of about 90 micrometers.
6. The cured silicone of claim 2 , wherein the organopolysiloxane having at least two alkenyl groups per molecule is represented by the formula:
M a D b T c Q d ,
wherein
the subscripts a, b, c, and d are zero or a positive integer, subject to the limitation that if subscripts a and b are both equal to zero, subscript c is greater than or equal to two;
M has the formula R 3 SiO 1/2 ;
D has the formula R 2 SiO 2/2 ;
T has the formula R SiO 3/2 ; and
Q has the formula SiO 4/2 , wherein each R group independently represents hydrogen, alkenyl groups, substituted and unsubstituted monovalent hydrocarbon groups having from one to forty carbon atoms each, subject to the limitation that at least two of the R groups are alkenyl groups; and wherein
the organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule is generally represented by the formula:
M 1 D b T c Q d,
wherein
the subscripts a, b, c, and d are zero or a positive integer, subject to the limitation that if subscripts a and b are both equal to zero, subscript c is greater than or equal to two;
M′ has the formula R 3 SiO 1/2 ;
D′ has the formula R 2 SiO 2/2 ;
T′ has the formula RSiO 3/2 ; and
Q′ has the formula SiO 4/2 , wherein each R group independently represents hydrogen, substituted and unsubstituted monovalent hydrocarbon groups having from one to forty carbon atoms each, subject to the limitation that at least two of the R groups are hydrogen.
7. The cured silicone of claim 1 , wherein the electrically conductive filler is nickel-coated graphite.
8. The cured silicone of claim 7 , wherein the nickel-coated graphite comprises 60 wt. % nickel and has an average longest dimension of about 90 micrometers.
9. The cure silicone of claim 1 , wherein the electrically conductive filler comprises a ceramic substrate having a silver metal containing coating.
10. The cured silicone of claim 1 , wherein the electrically conductive filler comprises about 20 to about 85 wt % of the total weight of the composition.
11. The cured silicone of claim 1 , wherein the electrically conductive filler has an average longest dimension of about 35 to about 150 micrometers.
12. The cured silicone of claim 1 , further comprising a cure retardant in an amount of less than or equal to about 0.3 weight percent, based on the total weight of the organopolysiloxane mixture.
13. The cured silicone of claim 1 , further comprising a cross linking agent in an amount of less than or equal to about 0.5 weight percent, based on the total weight of the organopolysiloxane mixture.
14. The cured silicone of claim 1 , wherein the organopolysiloxane gel formulation is a two-part formulation comprising an organopolysiloxane having at least two alkenyl groups per molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and the organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule in the gel formulation provides 0.1 to less than 1.0 silicone-bonded hydrogen atoms per alkenyl group.
15. The cured silicone of claim 1 , wherein the organopolysiloxane gel formulation comprises about 5 to about 80 wt. % of the total organopolysiloxane mixture.
16. The cured silicone of claim 1 , further comprising an organopolysiloxane fluid having a viscosity of less than about 1000 cps.
17. The cured silicone of claim 16 , wherein the organopolysiloxane fluid has a boiling point greater than or equal to about 260° C. (500° F.).
18. The cured silicone of claim 6 , wherein the organopolysiloxane fluid is a non-reactive fluid, reactive fluid, or combination comprising at least one of the foregoing having a boiling point greater than or equal to about 260° C.
19. The cured silicone of claim 1 , wherein the organopolysiloxane fluid has a viscosity less than or equal to about 750 cps.
20. The cured silicone of claim 1 , wherein the organopolysiloxane mixture has a viscosity of less than about 100,000 cps.
21. The cured silicone of claim 1 , wherein the organopolysiloxane mixture has a viscosity of less than about 50,000 cps.
22. The cured silicone of claim 1 , wherein the organopolysiloxane mixture has a viscosity of less than 35,000 cps.
23. The cured silicone of claim 1 , wherein the electrically conductive filler comprises about 10 to about 90 wt %, of the total weight of the composition.
24. An article manufactured from the composition of claim 1 .
25. A gasket manufactured from the composition of claim 1 .
26. A method of making a cured silicone sheet, comprising: casting the composition of claim 1 onto a sheet; and allowing the composition to cure.