IP Library Granted Patent US 6,857,724
Granted Patent B2
US 6,857,724 · App. 10/120,348 · Granted Feb 22, 2005

Print assembly for a wide format pagewidth printer

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Quick Facts
Patent No.
US 6,857,724
App. No.
10/120,348
Granted
Feb 22, 2005
Kind
B2
Abstract

A print assembly for a wide format printer includes a carrier that is mountable on a support structure of the wide format printer in an operative position with respect to a platen of the wide format printer. A number of printhead chips are positioned on the carrier, the printhead chips together incorporating at least fifty thousand nozzle arrangements. The printhead chips are positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen. Control circuitry is also positioned on the carrier and is configured to control operation of the printhead chips.

Claims (27)

1. A print assembly for a wide format printer, the print assembly comprising:

an elongate carrier that is mountable on a support structure of the printer in an operative position with respect to a platen of the wide format printer,

a number of printhead chips positioned on the carrier, the printhead chips together incorporating at least fifty thousand nozzle arrangements, the printhead chips being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen, and wherein each of the printhead chips includes drive circuitry for selectively providing drive current to each of the nozzles for causing ejection of the ink drops; and

a plurality of control circuitry positioned on the carrier remote from the printhead chips and each configured to separately control operation of at least one printhead chip of the plurality of printhead chips by providing control signals to the drive circuitry associated with the at least one printhead chip in synchronization with the control signals provided by the other control circuitry to the other printhead chips.

2. A print assembly as claimed in claim 1 , in which the printhead chips together incorporate at least one hundred thousand nozzle arrangements.

3. A print assembly as claimed in claim 2 , in which the printhead chips together incorporate at least two hundred thousand nozzle arrangements.

4. A print assembly as claimed in claim 3 , which includes between forty and one hundred printhead chips positioned on the carrier.

5. A print assembly as claimed in claim 1 , in which each printhead chip is the product of an integrated circuit fabrication process.

6. A print assembly as claimed in claim 5 , in which each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the wafer substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer.

7. A print assembly as claimed in claim 6 , in which each nozzle arrangement is in the form of a micro electro-mechanical system that is electrically connected to the CMOS drive circuitry layer.

8. A print assembly as claimed in claim 6 , which includes a plurality of printhead module, each printhead module incorporating at least one of the printhead chips, the printhead modules being mounted on the carrier.

9. A print assembly as claimed in claim 8 , in which a flexible printed circuit board (PCB) is mounted on each printhead module and connected between the CMOS drive circuitry layer of each printhead chip and the control circuitry.

10. A print assembly as claimed in claim 8 , in which the printhead modules are configured so that the printhead chips are each positioned at a common angle of greater than zero degrees and less than ninety degrees with respect to a line extending a length of the printing zone, so that consecutive printhead chips overlap at their ends.

11. A wide format printer that comprises:

a support structure;

a print assembly positioned on the support structure, the print assembly comprising:

a carrier that is mounted in an operative position with respect to a platen of the wide format printer;

a number of printhead chips positioned on the carrier, the printhead chips together incorporating at least fifty thousand nozzle arrangements, the printhead chips being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen, and wherein each of the printhead chips includes drive circuitry for selectively providing drive current to each of the nozzles for causing ejection of the ink drops; and

a plurality of control circuitry positioned on the carrier remote from the printhead chips and each configured to separately control operation of at least one printhead chip of the plurality of printhead chips by providing control signals to the drive circuitry associated with the at least one printhead chip in synchronization with the control signals provided by the other control circuitry to the other printhead chips; and

a media feed mechanism positioned on the support structure to feed media into the print assembly.

12. A print assembly for a wide format printer, the print assembly comprising:

an elongate carrier that is mountable on a support structure of the printer in an operative position with respect to a platen of the wide format printer;

a number of printhead chips positioned on the carrier, the printhead chips together incorporating at least fifty thousand nozzle arrangements, the printhead chips being positioned so that the printhead chips are capable of ejecting ink drops into a printing zone defined by the platen, and wherein each of the printhead chips includes drive circuitry for selectively providing drive current to each of the nozzles for causing ejection of the ink drops; and

control circuitry positioned on the carrier remote from the printhead chips and configured to control operation of the printhead chips by providing control signals to the drive circuitry,

wherein each printhead chip includes a wafer substrate and a CMOS drive circuitry layer positioned on the wafer substrate with the nozzle arrangements positioned on the wafer substrate and the CMOS drive circuitry layer,

the printhead chips are incorporated in a plurality of printhead modules mounted on the carrier, and

a flexible printed circuit board (PCB) is mounted on each printhead module and connected between the CMOS drive circuitry layer of each printhead chip and the control circuitry.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028538/0965 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2002
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY. LTD.
Reel/Frame 012788/0151 →