IP Library › Granted Patent US 6,891,609
Granted Patent B2
US 6,891,609 · App. 10/120,639 · Granted May 10, 2005

Measurement box with module for measuring wafer characteristics

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Quick Facts
Patent No.
US 6,891,609
App. No.
10/120,639
Granted
May 10, 2005
Kind
B2
Abstract

A measurement box which can be integrated into existing wafer processing equipment. The measurement box comprises an enclosure which contains a measurement module for measuring objects such as the surfaces of wafers. The measurement module is equipped with a miniaturized measuring device and has a displaceable measuring head and a plane table with a rotatable wafer holder. The enclosure has at least one loading opening for the wafer to pass through as well as a ventilation device.

Claims (12)

1. A measurement box comprising: an enclosure in which is arranged a measurement module for measuring particularly the surface of wafers, said measurement module comprising a displaceable measuring head that is equipped with a miniaturized measuring device, said measurement module further comprising a plane table with a rotatable wafer support, wherein the enclosure has at least one loading opening for wafers to pass through, as well as a ventilation device, wherein the ventilation device is a ventilation grille arranged in a sidewall or at least one adjustable pressure relief valve, and wherein pressure in a wafer processing tool to which the measurement module is coupled is positive, and air, due to a pressure difference, flows out of the wafer processing tool through the loading opening into the measurement box and subsequently out through the ventilation device of the measurement box when the loading opening is open.

2. A measurement box according to claim 1 , wherein the enclosure has a base which is ≦350 mm×≦400 mm.

3. A measurement box according to claim 2 , wherein the loading opening can be closed.

4. A measurement box according to claim 1 , wherein the loading opening can be closed.

5. A measurement box according to claim 4 , wherein the loading opening is located in an interface plate, which forms a sidewall of the enclosure and has means for connection to the wafer processing tool as well as ports for connection with the media of the wafer processing tool.

6. A measurement box according to claim 1 , wherein the loading opening is located in an interface plate, which forms a sidewall of the enclosure and has means for connection to the wafer processing tool as well as ports for connection with the media of the wafer processing tool.

7. A measurement box according to claim 6 , wherein the ventilation device is arranged in the enclosure wall opposite the loading opening.

8. A measurement box according to claim 1 , wherein the ventilation device is arranged in the enclosure wall opposite the loading opening.

9. A measurement box according to claim 8 , wherein the loading opening is a horizontal slot.

10. A measurement box according to claim 1 , wherein the loading opening is a horizontal slot.

11. A measurement box according to claim 10 , wherein the ventilation device is the ventilation grille arranged in a sidewall.

12. A measurement box according to claim 10 , wherein the ventilation device is the at least one adjustable pressure relief valve.