Cylindrical microphone having an electret assembly in the end cover
View Patent ↗A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
1. A microphone for converting sound into an electrical signal, comprising:
a housing with a sound port for receiving said sound;
a diaphragm undergoing movement in response to said sound; and
a backplate positioned at a predetermined distance from said diaphragm, said backplate having an integral connecting wire electrically coupling said backplate to an electronic component within said housing, said integral connecting wire including a layer of material that is the same material used in said backplate, said connecting wire being unitary with said backplate.
2. The microphone of claim 1 , wherein said electronic component is an integrated circuit.
3. The microphone of claim 1 , wherein said electronic component is located on a printed circuit board within said housing, said integral connecting wire being attached to a contact pad on said printed circuit board.
4. The microphone of claim 1 , wherein said backplate includes a non-conductive structure and a conductive layer positioned on said non-conductive structure.
5. The microphone of claim 4 , wherein said conductive layer is a layer of metal.
6. The microphone of claim 5 , wherein said integral connecting wire includes said non-conductive layer and said metal layer.
7. The microphone of claim 4 , wherein said non-conductive layer is polyimide.
8. The microphone of claim 1 , wherein said integral connecting wire has a rectangular cross-section.
9. The microphone of claim 1 , wherein said integral connecting wire includes a nonconductive layer and a conductive layer.
10. The microphone of claim 9 , wherein said conductive layer is said same material as used in said backplate.
11. The microphone of claim 9 , wherein said nonconductive layer is said same material as used in said backplate.
12. The microphone of claim 1 , wherein said backplate includes a nonconductive layer, an electret layer, and a conductive layer.
13. The microphone of claim 1 , wherein said diaphragm has an electret layer.
14. The microphone of claim 12 , wherein said nonconductive layer is polyimide.
15. The microphone of claim 12 , wherein said electret layer is fluorinated polyethylene propylene and said conductive layer is gold.
16. The microphone of claim 12 , wherein said nonconductive layer is substantially thicker than said conductive layer.
17. The microphone of claim 1 , wherein said integral connecting wire has a length that is larger than a length of said housing to allow said integral connecting wire to be attached to said electronic component outside of said housing.
18. A microphone for converting sound into an electrical signal, comprising:
a housing with a sound port for receiving said sound;
a diaphragm undergoing movement in response to said sound; and
a backplate positioned at a predetermined distance from said diaphragm, said backplate having an integral connecting wire electrically connecting said backplate to an electronic component within said housing through contact pressure engagement, said integral connecting wire including a layer of material that is the same material used in said backplate, said connecting wire being unitary with said backplate.
19. The microphone of claim 18 , wherein said electronic component is an integrated circuit.
20. The microphone of claim 18 , wherein said electronic component is located on a printed circuit board within said housing, said integral connecting wire being in said contact pressure engagement with a contact pad on said printed circuit board.
21. The microphone of claim 18 , wherein said integral connecting wire has a rectangular cross-section.
22. The microphone of claim 18 , wherein said backplate includes a nonconductive layer, an electret layer, and a conductive layer.
23. The microphone of claim 18 , wherein said diaphragm has an electret layer.
24. The microphone of claim 22 , wherein said nonconductive layer is polyimide.
25. The microphone of claim 22 , wherein said electret layer is fluorinated polyethylene propylene and said conductive layer is a metal.
26. The microphone of claim 24 , wherein said integral connecting wire only includes said polyimide and said conductive layer at a terminal end where said contact pressure engagement occurs.
27. The microphone of claim 18 , wherein said integral connecting wire is selected to have a thickness dimension that is different from said backplate to produce a desired amount of spring force for said contact pressure engagement.
28. The microphone of claim 27 , wherein said selected thickness dimension is located at a bend region of said integral connecting wire.