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App. No. 10/128,813 · Confirmation No. 6875

High density substrate for the packaging of integrated circuits

Abandoned -- Failure to Respond to an Office Action View Publication ↗
⬇ PDF
 Code Description Pages PDF
2002-04-23 TRNA Transmittal of New Application 3 View
2002-04-23 ADS Application Data Sheet 3 View
2002-04-23 SPEC Specification 13 View
2002-04-23 CLM Claims 4 View
2002-04-23 ABST Abstract 1 View
2002-04-23 DRW Drawings-only black and white line drawings 6 View
2002-04-23 OATH Oath or Declaration filed 2 View
2002-04-23 LET. Miscellaneous Incoming Letter 1 View
2002-04-23 DRW Drawings-only black and white line drawings 6 View
2002-04-23 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
App. No.
10/128,813
Filed
2002-04-23
Pub. No.
US20030197285A1
Art Unit
2826