IP Library Granted Patent US 6,926,561
Granted Patent B1
US 6,926,561 · App. 10/139,928 · Granted Aug 9, 2005

Integrated high and low frequency connector assembly

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Quick Facts
Patent No.
US 6,926,561
App. No.
10/139,928
Granted
Aug 9, 2005
Kind
B1
Abstract

A connector assembly includes a substrate assembly and a receptacle. The substrate assembly includes a first substrate layer having a conductive trace that is accessible for direct electrical interconnection with a first conductor associated with another device. A second substrate layer on the assembly includes an electrical contact for electrical interconnection with a second conductor associated with the other device. The electrical contact on the second substrate layer is disposed such that when the substrate assembly is inserted into the receptacle, the electrical contact is electrically connected with the second conductor, a direct electrical interconnection between the conductive trace and the first conductor is maintained. The arrangement is advantageous in that the connector assembly is capable of transmitting low frequency signals through electrical connections that also serve to maintain a high frequency direct electrical interconnection.

Claims (10)

1. A connector assembly comprising:

a substrate assembly including

a receptacle;

a first substrate layer including a conductive trace, the conductive trace being accessible for direct electrical interconnection with a first conductor associated with the receptacle;

a second substrate layer including an electrical contact for electrical interconnection with a second conductor associated with said receptacle; and

a conductive contacting member, such that when the substrate assembly is inserted into the receptacle, the electrical contact is electrically connected with the second conductor via the contacting member, and the contacting member serves to maintain a direct electrical interconnection between the conductive trace and the first conductor.

2. The connector assembly of claim 1 wherein the conductive trace is for transmitting a high frequency signal and the electrical contact is for transmitting a lower frequency signal.

3. The connector assembly of claim 1 wherein the conductive contacting member is located on the receptacle.

4. The connector assembly of claim 1 wherein the conductive contacting member is located on the substrate assembly.

5. The connector assembly of claim 1 wherein the conductive contacting member is a leaf spring.

Assignments (6)
RELEASE (REEL 038041 / FRAME 0001) Recorded Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
SECURITY AGREEMENT Recorded Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2015
From: ROCKSTAR CONSORTIUM US LP; ROCKSTAR CONSORTIUM LLC; BOCKSTAR TECHNOLOGIES LLC; CONSTELLATION TECHNOLOGIES LLC; MOBILESTAR TECHNOLOGIES LLC; NETSTAR TECHNOLOGIES LLC
To: RPX CLEARINGHOUSE LLC
Reel/Frame 034924/0779 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2014
From: ROCKSTAR BIDCO, LP
To: ROCKSTAR CONSORTIUM US LP
Reel/Frame 032422/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2011
From: NORTEL NETWORKS LIMITED
To: ROCKSTAR BIDCO, LP
Reel/Frame 027164/0356 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2002
From: HANDFORTH, MARTIN R.; STANKUS, JOHN J.
To: NORTEL NETWORKS LIMITED
Reel/Frame 012873/0179 →