Resin encapsulation system
View Patent ↗In a resin encapsulation system, one or more middle molds remain free without being mechanically connected with an upper mold and a lower mold. The middle mold is circulated, by a middle-mold conveying mechanism, among a molding press, a middle-mold preheating unit, a middle-mold cleaning unit, and an ejecting pressing unit adapted to separate an encapsulated object, a runner, and a gate from the middle mold. Resin encapsulation molding is performed in the circulating process described above.
1. A resin encapsulation system comprising:
a molding press using an upper mold, a middle mold and a lower mold,
wherein, a middle mold conveying mechanism is provided, which inserts/removes the middle mold into/from said molding press,
wherein a runner portion is formed on the lower mold.
2. A resin encapsulation system according to claim 1 , further comprising:
a middle-mold preheating unit;
a middle-mold cleaning unit; and
an ejecting pressing unit to separate an encapsulated object, and a gate from the middle mold,
wherein, the middle mold is circulated among the molding press, the middle-mold preheating unit, the middle-mold cleaning unit, and the ejecting pressing unit by said middle-mold conveying mechanism.
3. A resin encapsulation system according to claim 1 ,
wherein a plurality of said middle-mold conveying mechanisms are provided.
4. A resin encapsulation system according to claim 1 ,
wherein a cavity portion and a gate portion for performing resin encapsulation in the middle mold with resin are provided.
5. A resin encapsulation system according to claim 1 ,
wherein a plurality of said middle molds are provided.
6. A resin encapsulation system according to claim 1 ,
wherein an ejector mechanism is provided on the lower mold.
7. A resin encapsulation system according to claim 3 ,
wherein a plurality of said molding presses are provided.
8. A resin encapsulation system according to claim 6 ,
wherein said ejector pressing unit ejects the encapsulated object, the runner and the gate separately.
9. The resin encapsulation system according to claim 1 , wherein the middle mold is provided with a notch, wherein the notch enables the middle mold conveying mechanism to grasp the middle mold during insertion and removal of the middle mold from said molding press.
10. The resin encapsulation system according to claim 1 , wherein a cavity portion and a gate portion are formed on the middle mold.