Encapsulation for electroluminescent devices
View Patent ↗An electroluminescent device having a protection layer in the cap bonding region to which the cap is bonded. The protection layer can be formed from photosensitive or non-photosensitive materials. The protection layer protects the layers below from being damage during removal of polymer materials.
1. An electroluminescent device comprising:
a substrate having an active region having at least one OLED cell;
an organic layer on the substrate in the OLED cell;
a cap bonding region surrounding the active region;
a photosensitive material forming a device layer, the photosensitive material having a first region of a first thickness that is covered by the organic layer and a second region of a second thickness less than the first thickness that is not covered by the organic layer and is located in the cap bonding region, wherein the first region and the second region each has a lower surface facing the substrate and an upper surface remote from the substrate, and the upper surface of the first region is not planar with the upper surface of the second region;
a cap bonded to the substrate in the cap bonding region; and
an adhesive used to bond the cap to the substrate.
2. The electroluminescent device of claim 1 wherein the photosensitive material comprises photoresist or polyimide.
3. The electroluminescent device of claim 1 wherein the cap, the second region of the device layer and the adhesive form a sealing system.
4. The electroluminescent device of claim 3 wherein materials of the sealing system are selected to provide desired sealing characteristics.
5. The device of claim 1 , further comprising a functional organic layer at least in the active region, the functional organic layer being co-planar with the device layer and extending at least to an edge of the second region of the device layer, but not extending into the cap bonding region.
6. An electroluminescent device comprising:
a substrate having an active region having at least one OLED cell;
an organic layer on the substrate in the OLED cell;
a cap bonding region surrounding the active region;
a non-photosensitive polyimide layer forming a device layer, the non-photosensitive polyimide layer having a first region of a first thickness that is covered by the organic layer and a second region of a second thickness less than the first thickness that is not covered by the organic layer and is located in the cap bonding region, wherein the first region and the second region each has a lower surface facing the substrate and an upper surface remote from the substrate, and the upper surface of the first region is not planar with the upper surface of the second region;
a cap bonded to the substrate in the cap bonding region; and
an adhesive used to bond the cap to the substrate.
7. The electroluminescent device of claim 6 wherein the cap, the second region of the device layer and the adhesive form a sealing system.
8. The electroluminescent device of claim 7 wherein materials of the sealing system are selected to provide desired sealing characteristics.
9. The electroluminescent device of claim 6 wherein the adhesive comprises a resin.
10. The electroluminescent device of claim 9 wherein the cap, the second region of the device layer and the adhesive form a sealing system.
11. The electroluminescent device of claim 10 wherein materials of the sealing system are selected to provide desired sealing characteristics.
12. An electroluminescent device, comprising:
a substrate having an active region having at least one OLED cell;
an organic layer on the substrate and in the OLED cell;
a cap bonding region surrounding the active region;
a photosensitive layer forming a device layer, the photosensitive layer having a first region of a first thickness that is covered by the organic layer and a second region of a second thickness less than the first thickness that is not covered by the organic layer and is located in the cap bonding region and forming a step, wherein the first region and the second region each has a lower surface facing the substrate and an upper surface remote from the substrate, and the upper surface of the second region is closer to the substrate than the upper surface of the first region;
a cap bonded to the substrate in the cap bonding region; and
an adhesive directly on the second region of the device layer used to bond the cap to the substrate.