Composition of bisphenol or novolak epoxy resin, epoxy resin from monoaromatic backbone and aromatic amine
View Patent ↗A composition useful as a matrix for fiber-reinforced composites possesses a viscosity at 25° C. of no more than 1000 mPa's, and provides a cured product displays a breaking elongation of at least 5%. The composition comprises (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak type epoxy resin (A2), a polyvalent epoxy resin formed from a mononuclear aromatic backbone (B), and an aromatic amine curing agent (C).
1. An epoxy resin composition with a viscosity at 25° C. of no more than 1000 mPa·s, comprising 100 parts by weight of (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak epoxy resin (A2), 20 to 100 parts by weight of a bivalent epoxy resin formed from a mononuclear aromatic backbone (B1), and a phenylenediamine derivative represented by a formula (1) shown below as an aromatic amine curing agent (C),
(wherein, R 1 , R 2 and R 3 represent any one of a methyl group, an ethyl group, an oxymethyl group and a thiomethyl group, and R 1 , R 2 and R 3 may be identical or different),
wherein a cured product produced by curing said epoxy resin composition displays a breaking elongation of at least 5%.
2. An epoxy resin composition with a viscosity at 25° C. of no more than 1000 mPa·s, comprising 100 parts by weight of (A) at least one of a bisphenol epoxy resin (A1) and a phenol novolak epoxy resin (A2), 20 to 100 parts by weight of a bivalent epoxy resin formed from a mononuclear aromatic backbone (B1), no more than 100 parts by weight of a trivalent epoxy resin formed from a mononuclear aromatic backbone (B2), and a phenylenediamine derivative represented by a formula (1) shown below as an aromatic amine curing agent (C),
(wherein, R 1 , R 2 and R 3 represent any one of a methyl group, an ethyl group, an oxymethyl group and a thiomethyl group, and R 1 , R 2 and R 3 may be identical or different),
wherein a cured product produced by curing said epoxy resin composition displays a breaking elongation of at least 5%.
3. An epoxy resin composition according to claim 2 , wherein said trivalent epoxy resin formed from a mononuclear aromatic backbone (B2) is a triglycidyl-p-aminophenol epoxy resin.
4. An epoxy resin composition according to claim 1 , wherein said bivalent epoxy resin formed from a mononuclear aromatic backbone (B1) is a diglycidylaniline type resin or a derivative thereof.
5. An epoxy resin composition according to claim 2 , wherein said bivalent epoxy resin formed from a mononuclear aromatic backbone (B1) is a diglycidylaniline resin or a derivative thereof, and said trivalent epoxy resin formed from a mononuclear aromatic backbone (B2) is a triglycidyl-p-aminophenol epoxy resin.
6. An epoxy resin composition according to claim 1 , wherein said bivalent epoxy resin formed from a mononuclear aromatic backbone (B1) is a diglycidyl-o-toluidine resin.
7. An epoxy resin composition according to claim 2 , wherein said bivalent epoxy resin formed from a mononuclear aromatic backbone (B1) is a diglycidyl-o-toluidine resin, and said trivalent epoxy resin formed from a mononuclear aromatic backbone (B2) is a triglycidyl-p-aminophenol epoxy resin.
8. An epoxy resin composition according to claim 2 , wherein said bivalent epoxy resin formed from a mononuclear aromatic backbone (B1) is a diglycidylaniline type resin or a derivative thereof.
9. An epoxy resin composition according to claim 2 , wherein said bivalent epoxy resin formed from a mononuclear aromatic backbone (B1) is a diglycidyl-o-toluidine resin.
10. An epoxy resin composition according to claim 1 , wherein a fracture toughness value K IC is at least 0.8 MPa·m 1/2 .
11. An epoxy resin composition according to claim 2 , wherein a fracture toughness value K IC is at least 0.8 MPa·m 1/2 .
12. An epoxy resin composition according to claim 1 , wherein a cured product thereof displays a glass transition temperature of at least 100° C. and an elastic modulus of at least 3 GPa.
13. An epoxy resin composition according to claim 2 , wherein a cured product thereof displays a glass transition temperature of at least 100° C. and an elastic modulus of at least 3 GPa.
14. A fiber reinforced composite material which uses an epoxy resin composition according to claim 1 , to as a matrix resin.
15. A fiber reinforced composite material which uses an epoxy resin composition according to claim 2 , to as a matrix resin.
16. An epoxy resin composition according to claim 1 , wherein the composition contains no compounds that incorporate a phenolic hydroxyl group.