System and method for mounting electronic components onto flexible substrates
View Patent ↗A system and method for reflowing solder to interconnect a plurality of electronic components ( 24 ) to a substrate ( 12 ) is disclosed. The system includes an oven for preheating the substrate ( 12 ) and the plurality of electronic components ( 24 ) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder ( 72 ), a pallet ( 14 ) for supporting the substrate ( 12 ), wherein the pallet ( 14 ) has at least one internal cavity ( 40 ), and a phase-transition material ( 42 ) disposed within the cavity ( 40 ) for absorbing heat from the pallet ( 14 ).
1. A system for reflowing solder to interconnect a plurality of electronic components to a substrate, the system comprising:
an oven for preheating the substrate and the plurality of electronic components disposed thereon;
a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder;
a pallet for supporting the substrate, wherein the pallet has an internal cavity having a phase-transition material disposed therein for absorbing heat from the substrate; and
a stencil positioned between the supplemental heat source and the electronic components to selectively direct heat from the supplemental heat source onto predefined portions of the substrate.
2. The system of claim 1 wherein the pallet has at least one tensioned pin to hold the substrate flat against the pallet.
3. The system of claim 1 further comprising a cover for covering portions of the substrate not to be exposed to the supplemental heat source.
4. The system of claim 1 wherein the phase-transition material is an alloy containing tin and lead.
5. The system of claim 1 wherein the phase-transition material is an alloy containing gallium.
6. The system of claim 1 wherein the supplemental heat source is a gas nozzle for directing hot gas onto the substrate.
7. The system of claim 1 further comprising a conveyor for transporting the pallet through the oven and under the supplemental heat source.
8. The system of claim 1 wherein the pallet further comprises an open cavity to accommodate electronic components mounted to both sides of the substrate.
9. The system of claim 1 wherein the open cavity further comprises a foam to provide support for the substrate.
10. The system of claim 1 further comprising a stencil positioned between the supplemental heat source and the electronic components to direct hot gas onto portions of the substrate.
11. The system of claim 1 wherein the supplemental heat source further comprises an array of hot gas nozzles, wherein the nozzles are independently actuatable and controllable to reflow the solder.
12. The system of claim 1 wherein the supplemental heat source is an infra red light source.
13. The system of claim 12 wherein the infra red light source further comprises a collimating lens for directing the infra red light onto the electronic components.
14. The system of claim 1 wherein the pallet further comprises at least one thermoelectric cooler for absorbing heat from the substrate.
15. The system of claim 1 wherein the pallet further comprises at least one heat pipe for absorbing heat from the substrate.
16. The system of claim 1 wherein the pallet has at least one internal cavity.
17. The system of claim 16 further comprising a phase-transition material disposed within the cavity for absorbing heat from the pallet.