Copper circuit formed by kinetic spray
View Patent ↗The invention concerns a copper-based circuit having an electrically insulative substrate, a bond layer including silver formed over select portions of the substrate according to a desired shape of the circuit, and an electrically conductive layer including plastically deformed particles of copper deposited on the bond layer. Furthermore, the invention also concerns a process for forming a copper-based circuit, wherein the process includes the steps of providing an electrically insulative substrate, forming a bond layer including silver over select portions of the substrate according to a desired shape of the circuit, and depositing copper on the bond layer by the steps of introducing copper particles into a pressurized carrier gas, forming the pressurized carrier gas and the copper particles into a supersonic jet, and directing the jet toward the bond layer formed over the substrate such that the jet has a velocity sufficient to cause plastic deformation of the copper particles onto the bond layer, thereby forming an electrically conductive layer on the bond layer.
1. A process for forming a copper-based circuit, said process comprising the steps of:
providing an electrically insulative substrate;
forming a bond layer comprising silver over select portions of said substrate according to a desired shape of a circuit; and
depositing copper on said bond layer by the steps of:
introducing copper particles having a particle size of about 45 microns to about 150 microns into a pressurized carrier gas;
forming said pressurized carrier gas and said copper particles into a supersonic jet; and
directing said jet toward said bond layer formed over said substrate without use of a mask and from a standoff distance of from 5 to 19 millimeters such that said jet has a velocity sufficient to cause plastic deformation of said copper particles onto said bond layer, thereby forming an electrically conductive layer only on said bond layer in the desired shape of the circuit by selective adherence of said copper particles to said bond layer.
2. The process according to claim 1 , wherein said substrate comprises an insulative material selected from the group consisting of aluminum oxide, aluminum nitride, boron nitride, silicon carbide, silicon nitride, diamond, and mixtures thereof.
3. The process according to claim 1 , wherein said bond layer comprises silver, silver-palladium or silver-platinum.
4. The process according to claim 1 , wherein said bond layer has a thickness of about 10 micrometers to about 12 micrometers.
5. The process according to claim 1 , wherein the step of forming a bond layer comprising silver over select portions of said substrate is achieved by screen printing said bond layer onto said substrate.
6. The process according to claim 1 , wherein said carrier gas has a pressure of about 1.2 MPa to about 2 MPa.
7. The process according to claim 1 , wherein said carrier gas has a temperature of about 100° C. to about 500° C.
8. The process according to claim 1 , wherein said jet is directed substantially normal to the surface of said bond layer formed over said substrate.