IP Library › Granted Patent US 6,869,008
Granted Patent B2
US 6,869,008 · App. 10/155,730 · Granted Mar 22, 2005

Method of forming bumps

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Quick Facts
Patent No.
US 6,869,008
App. No.
10/155,730
Granted
Mar 22, 2005
Kind
B2
Abstract

In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Claims (30)

1. A method for fabricating a semiconductor device, comprising the steps of:

coating a flux on a surface of pads of a semiconductor wafer;

mounting solder balls on a tool having through-holes, and having a part in which a spacer is provided in an area between through-holes and having a part in which a spacer is not provided in an area between through-holes;

keeping said tool at a distance from said semiconductor water by said spacers, to position said solder balls and said pads of said semiconductor wafer;

supplying said solder balls on said surface of said pads of said semiconductor water;

heating said semiconductor wafer in a reflow furnace; and

cutting said semiconductor wafer at a desired size.

2. A method according to claim 1 , wherein a thickness of said spacers is greater than a thickness of said flux on the surface of said pads of said semiconductor wafer.

3. A method according to claim 1 , wherein a thickness of said spacers is such that a height of an upper surface of the tool is at least 0.8 times the diameter of the solder balls, and less than the diameter thereof, from a surface of said semiconductor wafer.

4. A method according to claim 3 , wherein a thickness of said spacers is such that a gap between the surface of said semiconductor wafer and a bottom surface of said tool is at most 0.5 times the diameter of the solder balls.

5. A method according to claim 1 , wherein a thickness of said spacers is such that a gap between the surface of said semiconductor wafer and a bottom surface of said tool is at most 0.5 times the diameter of the solder balls.

6. A method of fabricating a semiconductor device, comprising the steps of:

coating a flux on at least one pad of a semiconductor wafer;

setting a tool, which has through-holes, and has a part in which a spacer is provided in an area between through-holes and has a part in which a spacer is not provided in an area between through-holes, over the semiconductor wafer so as to keep said tool at a distance from said semiconductor wafer by said spacers;

supplying a solder ball on the at least one pad by using the tool;

heating the semiconductor wafer in a reflow furnace; and

cutting said semiconductor wafer at a desired size.

7. A method for fabricating a semiconductor device, comprising the steps of:

coating a flux on a surface of pads of a semiconductor wafer;

mounting solder balls on a tool having through-holes, wherein the tool is provided with spacers between through-holes, at a spacer per a predetermined plural number of through-holes;

keeping said tool at a distance from said semiconductor wafer by said spacers, to position said solder balls and said pads of said semiconductor wafer;

supplying said solder balls on said surface of said pads of said semiconductor wafer;

heating said semiconductor wafer in a reflow furnace; and

cutting said semiconductor wafer at a desired size.

8. A method of fabricating a semiconductor device, comprising the steps of:

coating a flux on at least one pad of a semiconductor wafer;

setting a tool, which has through-holes and is provided with spacers between through-holes, at a spacer per a predetermined plural number of through-holes, over the semiconductor wafer so as to keep said tool at a distance from said semiconductor wafer by said spacers;

supplying a solder ball on the at least one pad by using the tool;

heating the semiconductor wafer in a reflow furnace; and

cutting said semiconductor wafer at a desired size.