Method for manufacturing printed circuit boards

1. A manufacturing process for printed circuit boards of the type comprising the following steps:

making a first selective engraving over a first face ( 10 a ) of a panel ( 10 ) of electro-conducting material to form reliefs ( 12 ) corresponding to future tracks and depressions ( 14 ) corresponding to future intermediate tracks;

applying by injection moulding a dielectric material 20 over said first face ( 10 a ) of the panel ( 10 ) of electro-conducting material, covering said reliefs ( 12 ) and filling said depressions ( 14 ); and,

making a second selective engraving over a second phase ( 10 b ) opposite to the first one of the mentioned panel ( 10 ) of electro-conducting material to eliminate the material thereof, corresponding to said future intermediate tracks, so that some finished tracks ( 16 ) remain, isolated from each other, separated by intermediate tracks ( 18 ) and partially embedded over a face of said dielectric material ( 20 ),

characterised in that, after the first engraving stage and before said injection moulding stage, it also comprises the following stages:

subjecting said previously engraved first face ( 10 a ) of the panel ( 10 ) of electro-conducting material to a surface treatment improving the joining capacity which comprises a black oxide operation consisting of placing said first face ( 10 a ) of the panel ( 10 ) of electro-conducting material in contact with an aqueous solution of sodium hydroxide and sodium hypochlorite producing a chemical micro-attack to provide a determined surface roughness; and

applying a layer of adhesive material ( 30 ) over said engraved and superficially treated first face ( 10 a ) of the panel ( 10 ) of electro-conducting material.

2. A process according to claim 1 , characterised in that the injection moulding stage is carried out between two of said panels ( 10 ) of conducting material kept separated by a predetermined distance, with their respective first faces ( 10 a ) previously engraved, treated superficially and with their respective layers of adhesive material ( 30 ) applied, one in front of the other, said selective second engraving being made over the respective second faces ( 10 b ) opposite to the first ones, of the mentioned two panels ( 10 ) of electro-conducting material to eliminate the material thereof, corresponding to said future intermediate tracks, so that some tracks ( 16 ) remain insulated from each other, separated by intermediate tracks ( 18 ) and partially embedded over two opposite faces of said dielectric material ( 20 ).

3. A process according to claim 1 , characterised in that said black oxide operation comprises:

applying a protection mask to said second face ( 10 b ) and/or parts not requiring treatment of the panel ( 10 ) of electro-conducting material;

subjecting the panel ( 10 ) of electro-conducting material to immersion or spraying treatment; and

then, removing said protection mask to leave a layer of black oxide ( 40 ) only in those areas destined to receive the dielectric material ( 20 ).

4. A process according to claim 1 , characterised in that black oxide operation comprises:

completely subjecting the panel ( 10 ) of electro-conducting material to immersion or spraying treatment; and

then, eliminating the black oxidation from said second phase ( 10 b ) and/or parts not requiring said treatment to leave a layer of black oxide ( 40 ) only in those areas destined to receive the dielectric material ( 20 ).

5. A process according to claim 1 , characterised in that said application of a layer of an adhesive material ( 30 ) is carried out by spraying.

6. A process according to claim 1 , characterised in that said adhesive material ( 30 ) comprises a base of organic solvents and a solid content formed by synthetic elastomers.

7. A process according to claim 6 , characterised in that the mentioned layer of adhesive material ( 30 ) is subjected to pre-drying, without reaching curing, to provoke the evaporation of said solvents before the injection moulding stage.

8. A process according to claim 7 , characterised in that said pre-drying is carried out in the air at room temperature.

9. A process according to claim 7 , characterised in that said pre-drying is carried out in an oven from 25 to 100° C.

10. A process according to claim 1 , characterised in that during said injection moulding stage, the adhesive material ( 30 ) is activated on coming into contact with said dielectric material ( 20 ) at high pressure and temperature, providing adhesion between said dielectric material ( 20 ) and the panel ( 10 ) of electro-conducting material.

11. A process according to claim 1 , characterised in that the first engraving stage comprises:

submitting said panel ( 10 ) of electro-conducting material to chemical polishing; depositing a layer of photosensitive material over both the first and second faces ( 10 a , 10 b ) of the panel ( 10 ) of electro-conducting material;

insulating said layer of photosensitive material of the first face ( 10 a ) by means of a photolyte corresponding to said future tracks;

insulating said layer of photosensitive material of the second face ( 10 b ) completely;

eliminating those parts of the not insulated layers of the photosensitive material;

subjecting the panel ( 10 ) of electro-conducting material, with the parts of the layers of remaining photosensitive material to engraving by chemical attack; and eliminating the parts of the layers of photosensitive material remaining on both faces.

12. A process according to claim 1 , characterised in that the stage of the second engraving comprises:

depositing a layer of photosensitive material over said second face ( 10 b ) of the panel ( 10 ) of electro-conducting material;

insulating said layer of photosensitive material of the second face ( 10 b ) by means of a photolyte corresponding to said future tracks, in a position coinciding with said reliefs ( 12 ) of the first face ( 10 a );

eliminating those parts of the layer of non-insulated photosensitive material;

subjecting the panel ( 10 ) of electro-conducting material, adhered by the first face ( 10 a ) to the dielectric material ( 20 ) and with the parts of the remaining layers of photosensitive material ( 50 ) of the second face ( 10 b ), to an engraving by chemical attack to insulate said tracks ( 16 ), and eliminating the parts of the remaining layers of photosensitive material ( 50 ) on the tracks ( 16 ).

13. A process according to claim 1 , characterised in that both the first and second engraving stages are carried out mechanically.

14. A process according to claim 1 , characterised in that both the first and second engraving stages are carried out by laser radiation.

15. A process according to claim 1 , characterised in that after the second engraving stage, it also comprises an application stage of an anti-soldering mask including:

applying a layer of photosensitive material over the exposed areas of the electro-conducting material forming said tracks ( 16 ) and over the exposed areas of the dielectric material ( 20 ) in said intermediate tracks ( 18 );

insulating said layer of photosensitive material from the second face ( 10 b ) by means of a photolyte with a pattern corresponding to some soldering crowns; and

eliminating those parts of the layer of photosensitive material not insulated.

16. A process according to claim 15 , characterised in that it also comprises an application stage of a passivation treatment of said soldering crowns.

17. A process according to claim 16 , characterised in that it also comprises a stamping stage to open some holes in the soldering crowns to insert electronic components.

18. A process according to claim 1 , characterised in that the engraving of the first engraving stage to make said depressions ( 14 ) corresponding to future intermediate tracks reaches a depth from 85% to 95% of the thickness of the panel ( 10 ) of electro-conducting material, so that said finished tracks ( 16 ), partially embedded in dielectric material ( 20 ), have a protruding part representing from 5 to 15% of its thickness.

19. A process according to claim 1 , characterised in that said panel ( 10 ) of electro-conducting material is a copper panel.

20. A process according to claim 19 , characterised in that said panel ( 10 ) of copper has an approximate thickness of 400 μm, suitable for power applications.

21. A process according to claim 2 , characterised in that said application of a layer of an adhesive material ( 30 ) is carried out by spraying.

22. A process according to claim 2 , characterised in that said adhesive material ( 30 ) comprises a base of organic solvents and a solid content formed by synthetic elastomers.

23. A process according to claim 2 , characterised in that during said injection moulding stage, the adhesive material ( 30 ) is activated on coming into contact with said dielectric material ( 20 ) at high pressure and temperature, providing adhesion between said dielectric material ( 20 ) and the panel ( 10 ) of electro-conducting material.

24. A process according to claim 2 , characterised in that the first engraving stage comprises:

submitting said panel ( 10 ) of electro-conducting material to chemical polishing; depositing a layer of photosensitive material over both the first and second faces ( 10 a , 10 b ) of the panel ( 10 ) of electro-conducting material;

insulating said layer of photosensitive material of the first face ( 10 a ) by means of a photolyte corresponding to said future tracks;

insulating said layer of photosensitive material of the second face ( 10 b ) completely;

eliminating those parts of the not insulated layers of the photosensitive material;

subjecting the panel ( 10 ) of electro-conducting material, with the parts of the layers of remaining photosensitive material to engraving by chemical attack; and eliminating the parts of the layers of photosensitive material remaining on both faces.

25. A process according to claim 2 , characterised in that the stage of the second engraving comprises:

depositing a layer of photosensitive material over said second face ( 10 b ) of the panel ( 10 ) of electro-conducting material;

insulating said layer of photosensitive material of the second face ( 10 b ) by means of a photolyte corresponding to said future tracks, in a position coinciding with said reliefs ( 12 ) of the first face ( 10 a );

eliminating those parts of the layer of non-insulated photosensitive material;

subjecting the panel ( 10 ) of electro-conducting material, adhered by the first face ( 10 a ) to the dielectric material ( 20 ) and with the parts of the remaining layers of photosensitive material ( 50 ) of the second face ( 10 b ), to an engraving by chemical attack to insulate said tracks ( 16 ), and eliminating the parts of the remaining layers of photosensitive material ( 50 ) on the tracks ( 16 ).

26. A process according to claim 2 , characterised in that both the first and second engraving stages are carried out mechanically.

27. A process according to claim 2 , characterised in that both the first and second engraving stages are carried out by laser radiation.

28. A process according to claim 2 , characterised in that after the second engraving stage, it also comprises an application stage of an anti-soldering mask including:

applying a layer of photosensitive material over the exposed areas of the electro-conducting material forming said tracks ( 16 ) and over the exposed areas of the dielectric material ( 20 ) in said intermediate tracks ( 18 );

insulating said layer of photosensitive material from the second face ( 10 b ) by means of a photolyte with a pattern corresponding to some soldering crowns; and

eliminating those parts of the layer of photosensitive material not insulated.

29. A process according to claim 2 , characterised in that the engraving of the first engraving stage to make said depressions ( 14 ) corresponding to future intermediate tracks reaches a depth from 85% to 95% of the thickness of the panel ( 10 ) of electro-conducting material, so that said finished tracks ( 16 ), partially embedded in dielectric material ( 20 ), have a protruding part representing from 5 to 15% of its thickness.

30. A process according to claim 2 , characterized in that said panel ( 10 ) of electro-conducting material is a copper panel.