IP Library Granted Patent US 6,646,343
Granted Patent Utility
US 6,646,343 · Confirmation No. 5716

MATCHED IMPEDANCE BONDING TECHNIQUE IN HIGH-SPEED INTEGRATED CIRCUITS

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Code Description Pages PDF
2007-05-07 LET. Miscellaneous Incoming Letter 1 View
2007-05-07 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-09-12 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-09-18 TRNA Transmittal of New Application 3 View
2002-09-18 DRW Drawings-only black and white line drawings 5 View
2002-06-14 TRNA Transmittal of New Application 2 View
2002-06-14 SPEC Specification 6 View
2002-06-14 CLM Claims 3 View
2002-06-14 ABST Abstract 1 View
2002-06-14 DRW Drawings-only black and white line drawings 6 View
2002-06-14 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,646,343
App. No.
10/173,210
Filed
2002-06-14
Granted
2003-11-11
Examiner
HO, TU TU V
Art Unit
2818
PTA
-7 days