IP Library Granted Patent US 7,277,152
Granted Patent B2
US 7,277,152 · App. 10/173,897 · Granted Oct 2, 2007

Method for manufacturing active matrix type liquid crystal display device comprising annealing of the passivation film

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Quick Facts
Patent No.
US 7,277,152
App. No.
10/173,897
Granted
Oct 2, 2007
Kind
B2
Abstract

A TFT and a passivation film are formed on a transparent substrate and thereafter the passivation film is annealed. When measuring drain currents of a TFT at a fixed turn-on voltage (Von) and a fixed turn-off voltage (Voff), although performance of a TFT annealed (solid line) rarely changes, performance of a TFT not annealed (dashed line) changes to a large extent, in more detail, drain current drastically decreases in accordance with the change of TFT performance. This phenomenon means that on-resistance of a TFT not annealed is being increased to a great extent.

Claims (24)

1. A method for manufacturing an active matrix type liquid crystal display device, comprising the steps of:

forming a thin film transistor on a transparent substrate;

forming a passivation film covering said thin film transistor on said transparent substrate;

annealing said passivation film to diffuse ions and radicals in said passivation film;

forming a first opening in said passivation film so as to reach a source electrode of said thin film transistor;

forming a pixel electrode connected to said source electrode via said first opening on said passivation film, wherein said annealing of said passivation film is performed after said forming of said pixel electrode; and

wherein said pixel electrode contacts a portion of said passivation film.

2. The method for manufacturing the active matrix type liquid crystal display device according to claim 1 , wherein said annealing of said passivation film is performed before said forming of said first opening.

3. The method for manufacturing the active matrix type liquid crystal display device according to claim 2 , further comprising a step of removing an oxide film existing in a surface of said source electrode and exposed through said first opening between said step for forming said first opening and said step for forming said pixel electrode.

4. The method of claim 1 , wherein the step of annealing further comprises annealing the passivation film at a temperature of less than 350 degrees Celsius.

5. The method of claim 1 , wherein the passivation film further comprises SiN x .

6. A method for manufacturing an active matrix type liquid crystal display device, comprising the steps of:

forming a thin film transistor on a transparent substrate;

forming a passivation film covering said thin film transistor on said transparent substrate;

annealing said passivation film to diffuse ions and radicals in said passivation film;

forming a first opening in said passivation film so as to reach a source electrode of said thin film transistor;

forming an organic film on said passivation film, wherein said annealing of said passivation film is performed between said forming of said first opening and said forming of said organic film;

forming a second opening in said organic film so as to be aligned with said first opening; and

forming a pixel electrode connected to said source electrode via said first and second openings on said organic film,

wherein said pixel electrode contacts a portion of said passivation film.

7. The method for manufacturing the active matrix type liquid crystal display device according to claim 6 , wherein said annealing of said passivation film is performed before said forming of said first opening.

8. The method for manufacturing the active matrix type liquid crystal display device according to claim 7 , further comprising a step of removing an oxide film existing in a surface of said source electrode and exposed through said second opening between said step for forming said second opening and said step for forming said pixel electrode.

9. The method for manufacturing the active matrix type liquid crystal display device according to claim 6 , further comprising a step of removing an oxide film existing in a surface of said source electrode and exposed through said second opening between said step for forming said second opening and said step for forming said pixel electrode.

10. The method for manufacturing the active matrix type liquid crystal display device according to claim 6 , wherein said annealing of said passivation film is performed before said forming of said organic film.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2023
From: GOLD CHARM LIMITED
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 063321/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2013
From: NEC CORPORATION
To: GOLD CHARM LIMITED
Reel/Frame 030037/0092 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2010
From: NEC LCD TECHNOLOGIES, LTD.
To: NEC CORPORATION
Reel/Frame 024494/0980 →
TRANSFER OF 50% INTEREST; ORIGINAL ASSIGNEE RETAINS 50% INTEREST Recorded May 5, 2003
From: NEC CORPORATION
To: NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 014030/0635 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2002
From: SAKAMOTO, MICHIAKI; YAMAGUCHI, YUICHI
To: NEC CORPORATION
Reel/Frame 013016/0983 →