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App. No. 10/176,874 · Confirmation No. 6201

STRUCTURE AND METHOD FOR REDEPOSITION FREE THIN FILM CPP READ SENSOR FABRICATION

Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗
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 Code Description Pages PDF
2006-06-14 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-08-30 IFEE Issue Fee Payment (PTO-85B) 3 View
2002-06-21 TRNA Transmittal of New Application 4 View
2002-06-21 A.PE Preliminary Amendment 23 View
2002-06-21 SPEC Specification 14 View
2002-06-21 CLM Claims 6 View
2002-06-21 ABST Abstract 1 View
2002-06-21 DRW Drawings-only black and white line drawings 2 View
2002-06-21 OATH Oath or Declaration filed 13 View
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Quick Facts
App. No.
10/176,874
Filed
2002-06-21
Granted
2004-12-21
Art Unit
2652
PTA
-63 days