Insitu-cooled electrical assemblage
View Patent ↗An electrical assemblage reduces heat generated by components during operation. The assemblage has at least one heat-generating component, typically a resistor, and at least one heat-removing element electrically associated with the heat-generating component. Heat-removing element comprises a plurality of vias therein and is fixedly attached to a tip of the electrical components, typically on opposed charged ends. Heat absorbed by the heat-removing element is then transported to a heat sink, cooperatively associated therewith, for disposal. In an electrical assemblage, a circuit board contains multiple heat generating components each being associated with a heat-removing element of the invention.
1. An electrical assemblage, comprising:
a main portion having a top surface and a bottom surface for supporting at least one component on said top surface, said at least one component having a junction temperature T j and first and second mating surfaces;
means for reducing said junction temperature T j of said at least one component comprising at least one two-piece heat removing element comprising a top pad on said top surface and a bottom pad on said bottom surface, said top pad having a first end, a second end and a web intermediate said ends, said first end being bonded to said main portion and having a plurality of thermal vias therein extending between said top and bottom pads, said second end being electrically associated with either of said first and second mating surfaces of said at least one component and forming a thermal transport path therebetween said plurality of thermal vias being separated from said either of said first and second mating surfaces by said web; and,
a heat sink adjacent to and bonded to said bottom pad, said thermal transport path extending from said top pad through said thermal vias to said bottom pad and from said bottom pad to said adjacent heat sink, said heat sink absorbing heat transferred along said thermal transport path for reducing said junction temperature T j of said at least one component to a temperature T 1 , wherein T 1 is less than T j .
2. The electrical assemblage recited in claim 1 wherein said plurality of thermal vias are arranged in a grid-like pattern with each one of said plurality of thermal vias having a diameter of about 0.022 inches.
3. The electrical assemblage recited in claim 2 , wherein nearest adjacent thermal vias are spaced about 0.040 inches apart as measured from a center portion of a first thermal vias to a second center portion of a nearest adjacent second thermal vias.
4. The electrical assemblage recited in claim 2 wherein each one of said plurality of thermal vias is filled with a solder material.
5. The electrical assemblage recited in claim 2 wherein each one of said plurality of thermal vias has an electrical path terminating on a copper coated portion of said main portion.
6. The electrical assemblage recited in claim 1 wherein said heat sink comprises aluminum having a thickness of about 0.090 inches.
7. The electrical assemblage recited in claim 1 wherein said heat sink is bonded to said bottom pad with a silicon based, thermally conductive, electrically isolating adhesive film material.
8. The electrical assemblage recited in claim 7 wherein said adhesive film material comprises 0.007 inch diameter glass beads incorporated therein to facilitate bonding.
9. The electrical assemblage recited in claim 1 wherein said main portion is a polyimide circuit board having a plurality of copper layers.
10. The electrical assemblage recited in claim 9 wherein said plurality of copper layers comprises an outer layer having a weight of about one oz and inner layers beneath said outer layer having a weight of about 1/2 oz.
11. The electrical assemblage recited in claim 1 wherein said top pad of said heat removing element is T-shaped with said first end forming a head of the T and said web and said second end forming a body of the T.
12. The electrical assemblage recited in claim 1 wherein said web has an opening.
13. The electrical assemblage recited in claim 1 wherein said web has a plurality of openings.
14. The electrical assemblage recited in claim 1 wherein said web has a plurality of openings and wherein said top pad of said heat removing element is T-shaped with said first end forming a head of the T and said web and said second end forming a body of the T.
15. An electrical assemblage, comprising:
a circuit board having a top surface and a bottom surface for supporting at least one component on said top surface;
at least one two-member heat removing element having a top pad on said top surface and a bottom pad on said bottom surface, said top pad having a first end, a second end and a web intermediate said ends, said first end being bonded to said top surface of said circuit board, said second end being electrically associated with either of a first and a second mating surface of said at least one component;
a plurality of thermal vias extending between said top and bottom pads forming a thermal transport path therebetween for transferring heat to said bottom pad, said plurality of thermal vias being separated from said either of said first and second mating surfaces by said web; and
a heat sink bonded to said bottom pad for absorbing heat transferred to said bottom pad through said thermal vias from said at least one component.
16. The electrical assemblage recited in claim 15 wherein said top pad of said heat removing element is T-shaped with said first end forming a head of the T and said web and said second end forming a body of the T.
17. The electrical assemblage recited in claim 15 wherein said web has an opening.
18. The electrical assemblage recited in claim 11 wherein said web has a plurality of openings.
19. The electrical assemblage recited in claim 15 wherein said web has a plurality of openings and wherein said top pad of said heat removing element is T-shaped with said first end forming a head of the T and said web and said second end forming a body of the T.